Nitrogen Compounds TRIZ Cases

See how TiN nanofiber-enhanced polymer electrolyte increases ionic conductivity and lithium ion

See how electrospinning with acoustic mixing disperses BNNT at >5 wt% to form thermal-resistant

Electrochemical oxidation-state control in metal organic frameworks enables selective guest adsorption and release with lower energy use and simpler equipment.

A four-nitrate molten salt cuts liquidus temperature below 100°C while staying stable above 500°C for solar heat transfer and storage.

Organic cation exchange makes Ti3C2Tz MXene hydrophobic, enabling stable nonpolar solvent dispersion and better polysulfide trapping.

Direct laser-induced transfer deposits graphene, MoS2, and h-BN with clean interfaces and precise patterns while avoiding wet-transfer damage.

Using β-type silicon nitride and controlled firing, this case cuts surface pores that trap boron nitride residues and weaken metal lamination.

Fine oxygen and nitrogen bubbles counter stagnant water around floating generators, boosting plankton growth while reducing barnacle fouling.

Atomic-scale carbon embedding, Si-C/Si-N bonding, and a carbon shell help silicon anodes curb swelling while improving cycling and rate capability.

Refined and deagglomerated BNNTs in a polymer matrix improve heat transfer, strength, and electrical insulation for high-power electronics.

Mechanical pressure and cyanamide-assisted sintering produce a denser metal oxynitride body with fewer voids and better dielectric insulation.

Specific titanium complexes enable low-temperature CVD or ALD without oxidative gases, improving conformal thin-film deposition on 3D semiconductor surfaces.

A three-peak boron nitride particle distribution improves filler packing and thermal pathways in heat dissipation sheets for hotter compact electronics.

Solid-solution doping with Ti, Ge, Zr, Ag, Ba, or Hf helps silicon nitride retain volume resistivity and insulation at high temperatures.

A low-oxygen GaN sintered target replaces melting gallium, enabling stable sputtering and larger, high-crystallinity thin films.

Angled boron nitride nanotube coatings on battery separators create ion pathways that improve conductivity and limit thermal shrinkage.

Controlled 2-10 nm titanium nitride and oxynitride phases help silicon anodes limit swelling and electrolyte reactivity for longer cell life.

Alternating boron nitride and low-k insertion layers keep dielectric constant low at greater film thickness, reducing parasitic capacitance.

A silicon-containing oxide coating protects aluminum nitride from hydrolysis while preserving thermal conductivity in resin fillers.

A core-shell rare earth-iron-nitrogen powder uses an α-Fe outer region to cut iron loss while supporting magnetic amplification up to 1 THz.

Controlled bimodal particle sizing and polyhedral AlN particles raise resin thermal conductivity while preserving fluidity and handleability.

A dual-salt fluorosulfonyl electrolyte balances LiFSI depletion and solvent oxidation to improve lithium metal battery durability and ionic conductivity.

Surface-oxygen-treated boron nitride particles improve resin adhesion while preserving thermal conduction in heat-dissipating sheets.

Mesogenic Formula (I) compounds adsorb on inorganic nitride surfaces to improve resin dispersibility and thermal conduction in conductive layers.

Van der Waals encapsulation and heat-pressure conversion enable large-area black phosphorus sheets with environmental protection and strong semiconductor behavior.

Controlled tap density and void volume in agglomerated BN powder improve heat-sheet thermal conduction while preserving withstand voltage.

A conformal graphene or boron-nitride coating spreads PCB heat while preserving electrical insulation and reducing assembly weight.

A boron nitride filler gradient boosts heat conduction while preserving adhesion to copper foil and reducing interface peeling.

Hot-solution immersion and N2 calcination form uniform carbon nitride electrode films with controllable thickness and strong substrate contact.

A lithium ion conductor composition balances high conductivity with lithium metal stability to curb dendrites and short-circuit risk.

Surface adsorption of fused-ring functional compounds improves inorganic nitride dispersibility in organic matrices while preserving heat conduction.

Inclined reduced-pressure plasma treatment improves h-BN powder heat conduction while preserving agglomerates and limiting device overheating.

A silicon nitride sintered chuck substrate improves plasma and thermal shock resistance while maintaining heat dissipation for semiconductor processing.

Calcining nitride fluorescent material with controlled crystallite size reduces voids and binder reactions, raising light emission intensity.

Adsorbed aromatic surface modifiers help inorganic nitride disperse in organic matrices while preserving thermal conductivity for heat-dissipating layers.

A thin silicon-containing oxide coating protects aluminum nitride particles from moisture while preserving thermal conductivity in resin fillers.

Vanadium nitride on porous carbon accelerates polysulfide-to-lithium sulfide conversion, cutting overvoltage and capacity fade in lithium-sulfur batteries.

Independent gas and reagent dosing lets plasma treatment use non-volatile liquids or solids for precise surface functionalization.

Rotational agitation and fluid-based temperature control keep glow-discharge plasma treatment uniform while limiting heating, arcing, and sample degradation.

Heat-treated silicon-containing aluminum nitride particles raise visible reflectance while preserving thermal conductivity in light emitting devices.

Copper-phosphorous bimetallic catalysts improve oxygen reduction and hydrogen evolution while lowering reliance on costly platinum.

A dual-particle resin composition fills voids under pressing to improve thermal conductivity, insulation, dielectric strength, and adhesion.

Silicon and oxygen tuning in AlN particles raises visible-light reflectance while preserving heat conduction for LED resin fillers.

Controlling L*a*b* color values in an alumina phosphor plate suppresses blackening and preserves orange-light luminance and conversion efficiency.

Multiple transformer settings and arc detection keep glow-discharge plasma stable across gas and pressure changes while reducing equipment damage.

Elemental additives deposited at fiber grain boundaries block atomic diffusion and slow grain growth, improving high-temperature creep resistance.

Calcium-doped AlN improves coupling, sound velocity, and temperature stability in compact BAW and FBAR acoustic wave filters.

Direct hBN-to-cBN conversion removes binders that weaken sintered bodies, improving strength, thermal stability, and tool life.

Compressed, partially aligned BNNT buckyweaves improve damping and structural integrity across extreme temperatures without binders.

Controlling oxygen at cBN grain interfaces with a WC-Co-Al binder improves grain bonding, reduces chipping, and extends cutting tool life.

Refractory reinforcement bonded to thin PCD or PCBN layers improves crack resistance during sintering and processing into tool segments.

Thermal pretreatment of boron nitride powder before high-pressure sintering improves cBN hardness, strength, and thermal stability for tools.

Bent boron nitride particles resolve insufficient particle contact in heat dissipation materials by forming efficient three-dimensional heat transfer paths.