Resin Laminate Filler Composition for Thermal Conductivity and Insulation
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Solution Overview
Problem
Conventional curable compositions containing boron nitride aggregate particles face challenges in maintaining isotropy of thermal conductivity, leading to void formation, deterioration of insulating properties, and variation in dielectric breakdown strength, while also struggling with adhesion issues due to particle deformation during sheet forming.
Innovation Solution
A resin material comprising first and second inorganic particles with specific compressive strength ratios and porosity, where the second particles have a lower compressive strength and higher porosity, allowing for moderate deformation and filling of voids, thereby improving thermal conductivity and insulating properties, and enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If boron nitride aggregate particles are used to improve thermal conductivity in the thickness direction, then thermal conductivity is improved, but voids remain between particles causing deterioration of insulating properties
Solution Approach 1:
The invention uses a composite filler system combining boron nitride aggregate particles (for thermal conductivity) with spherical particles having lower compressive strength (for void filling and insulation). This composite approach allows simultaneous achievement of high thermal conductivity and good insulating properties by leveraging the complementary strengths of different particle types.
Solution Approach 2:
The invention creates local quality differentiation by using particles with different compressive strengths in different regions/functions: boron nitride aggregate particles provide thermal conduction pathways, while spherical particles with lower compressive strength fill voids between them. This local differentiation of particle properties optimizes both thermal conductivity and insulating properties in different locations within the resin composition.
2Reliability
If pressing is applied to remove voids between boron nitride aggregate particles, then insulating properties improve, but particle deformation occurs causing loss of thermal conductivity isotropy
Solution Approach 1:
The invention changes the physical parameters of the filler particles by selecting spherical particles with specifically controlled compressive strength (lower than boron nitride aggregate particles). This parameter change allows the spherical particles to deform preferentially under pressing, filling voids without causing the boron nitride aggregate particles to deform, thereby maintaining thermal conductivity isotropy while improving insulating properties.
Solution Approach 2:
The spherical particles with lower compressive strength act as intermediary elements between the boron nitride aggregate particles. During pressing, these intermediary spherical particles deform and fill the voids between the rigid boron nitride aggregate particles, mediating the pressing process to achieve void elimination without transmitting excessive stress to the thermal conduction particles.
3Ease of manufacture
If conventional curable compositions are used, then manufacturing is simple, but adhesion deteriorates due to particle deformation during sheet forming
Solution Approach 1:
The invention changes the compressive strength parameter of the filler particle system by incorporating spherical particles with lower compressive strength than conventional boron nitride aggregate particles alone. This parameter change enables the particles to undergo controlled deformation during sheet forming, improving adhesion between layers while maintaining manufacturing simplicity through conventional processing methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin material effectively enhances thermal conductivity, insulating properties, and dielectric breakdown strength while improving adhesion by controlling the deformation and alignment of inorganic particles, thereby addressing the limitations of conventional compositions.
Implementation Method 1
the second inorganic particles deform or collapse, and the isotropy of the thermal conductivity of the boron nitride aggregate particles can be lost
Implementation Method 2
it is necessary not to, for example, collapse the boron nitride aggregate particles by pressing at the time of pressing such as sheet forming
Implementation Method 3
the coefficient of thermal conductivity in the planar direction is higher than the coefficient of thermal conductivity in the thickness direction, and the coefficient of thermal conductivity has anisotropy
Implementation Method 4
a resin material containing inorganic particles, and a binder resin
Data Source
AI summary
Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.