PCB Heat Spreading Coating With Graphene for Lightweight Cooling
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Solution Overview
Problem
Existing thermal management solutions for electronic devices, such as thick copper or aluminum, increase weight and cost while struggling to efficiently dissipate heat, particularly in weight-restricted applications like aircraft and spacecraft.
Innovation Solution
The use of a heat spreading coating comprising a plurality of graphene and/or boron-nitride very high thermal conductivity particles, flakes, and/or sheets embedded in conformal coatings on electronic circuits, which enhances thermal conductivity without increasing weight or size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thick copper or aluminum is used for heat dissipation, then thermal conductivity is improved, but weight increases significantly
Solution Approach 1:
The patent uses composite materials consisting of graphene particles embedded in a conformal coating matrix to achieve high thermal conductivity without the weight penalty of traditional metal heat sinks. The graphene-conformal coating composite provides efficient heat spreading while maintaining lightweight characteristics essential for aerospace applications.
Solution Approach 2:
The invention changes the material parameters by transitioning from bulk metal (copper/aluminum) to nanoscale graphene particles embedded in a polymer matrix. This parameter change enables achieving comparable or superior thermal performance with dramatically reduced weight and thickness.
2Weight of moving object
If aluminum is used instead of copper for weight reduction, then weight decreases, but thermal conductivity reduces requiring thicker material
Solution Approach 1:
The patent employs a composite structure combining graphene particles with conformal coating material to achieve high thermal conductivity in a thin layer. This composite approach eliminates the need for thick aluminum sheets while maintaining lightweight properties, as the graphene network provides superior heat spreading capability at nanoscale concentrations.
Solution Approach 2:
The invention applies heat spreading functionality locally at the component level through conformal coating application. Rather than using bulk material throughout the entire device, the thermal management is concentrated where needed - directly over heat-generating components - achieving efficient heat dissipation with minimal material volume.
3Reliability
If conformal coating is applied for electrical insulation, then electrical protection is improved, but thermal conductivity decreases
Solution Approach 1:
The patent transforms the conformal coating from a pure electrical insulator into a thermally conductive composite by embedding graphene particles within the coating matrix. This composite formulation maintains the electrical insulation properties of the conformal coating while adding high thermal conductivity through the graphene network, simultaneously addressing both electrical protection and heat dissipation requirements.
Solution Approach 2:
The modified conformal coating performs multiple functions simultaneously: it provides electrical insulation to protect circuitry, maintains environmental durability, and actively spreads heat away from components. This multi-functional coating eliminates the need for separate thermal management components, reducing overall device complexity and weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves heat spreading from electronic components, increases product reliability, reduces the size and weight of electronic assemblies, and maintains high thermal performance even with higher power consumption components.
Implementation Method 1
a first heat spreading layer, applied over the polymeric coating, comprises: at least one heat spreading component selected from the group consisting of: a plurality of graphene nano-platelets, a plurality of graphene particles, a plurality of boron-nitride particles, a plurality of graphene flakes, a plurality of boron-nitride flakes, at least one graphene sheets
Implementation Method 2
an electrically isolating polymeric coating applied over the electric conducting traces and at least one heat producing electronic component
Implementation Method 3
the polymeric coating conforms with the irregular structure of the PCB
Data Source
AI summary
An electronic assembly with heat spreading coating is having a PCB carrying conducting traces heat producing electronic components. An electrically isolating polymeric coating is applied over the electric the traces and the heat producing electronic components. The electrically isolating polymeric coating conforms with an irregular structure of the PCB. A heat spreading layer is applied over the polymeric coating. The heat spreading layer comprises: at least one heat spreading zone selected from the group consisting of: a plurality of graphene nano-platelets, a plurality of graphene particles, a plurality of boron-nitride particles, a plurality of graphene flakes, a plurality of boron-nitride flakes, at least one graphene sheets, and combination thereof; and a binder, wherein the electrically isolating polymeric coating adheres to the PCB and covers the electric conducting traces and the heat producing electronic components, and the heat spreading layer conforms to the irregular structure of the polymeric coating.