Boss Layer Reduces OLED Connection Electrode Thickness
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Solution Overview
Problem
The existing manufacturing processes for active matrix OLED devices face challenges in ensuring reliable electrical connections between thin film transistors and second electrodes, while also being inefficient due to difficulties in etching and film formation during the production of connection electrodes.
Innovation Solution
The introduction of a boss layer between the color filter layer and the first electrode, which protrudes to form a boss, allows the second electrode to be positioned above it, reducing the thickness and complexity of the connection electrode, thereby improving the reliability and efficiency of electrical connections and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the connection electrode is made thicker to ensure reliable electrical connection, then the reliability of electrical connection improves, but the etching difficulty increases and production efficiency decreases
Solution Approach 1:
The patent introduces a boss layer that protrudes upward from the color filter layer, creating a vertical dimension elevation. This allows the second electrode to be positioned higher, thereby reducing the required thickness of the connection electrode while maintaining reliable electrical connection. The connection electrode thickness is reduced from the conventional range to a thinner range, improving etching efficiency and production throughput without sacrificing connection reliability.
Solution Approach 2:
The boss layer acts as an intermediary structure between the color filter layer and the second electrode. It provides a raised platform that facilitates better alignment and contact between the connection electrode and the second electrode, enabling reliable electrical connection with a thinner connection electrode. This intermediary structure solves the contradiction by mediating the spatial relationship between components.
2Reliability
If the connection electrode is made thicker to ensure reliable electrical connection, then the reliability of electrical connection improves, but the etching difficulty increases
Solution Approach 1:
By introducing the boss layer that protrudes in the vertical direction, the patent reduces the horizontal thickness requirement of the connection electrode. The raised position of the second electrode on the boss layer allows for a thinner connection electrode that is easier to etch with better pattern definition and fewer manufacturing challenges.
3Reliability
If the film formation time is increased to ensure reliable electrical connection, then the reliability of electrical connection improves, but the production efficiency decreases
Solution Approach 1:
The boss layer creates a vertical elevation that reduces the required film thickness of the connection electrode. Since film formation time is directly proportional to film thickness, reducing the thickness requirement significantly decreases the film formation time while maintaining adequate electrical connection reliability through the geometric advantage provided by the boss structure.
4Productivity
If the connection electrode is made thinner to improve production efficiency, then the production efficiency improves, but the reliability of electrical connection deteriorates
Solution Approach 1:
The boss layer compensates for the reduced thickness of the connection electrode by providing vertical elevation. This geometric compensation ensures that even with a thinner connection electrode, the electrical connection remains reliable due to the improved alignment and reduced contact pressure on the interface.
Solution Approach 2:
The boss layer serves as a mediator that enables thin connection electrodes to achieve reliable connections. It provides the necessary structural support and alignment facilitation that allows the thinner connection electrode to perform as effectively as a thicker one would have without the boss structure.
5Productivity
If the connection electrode is made thinner to reduce film formation time, then the production efficiency improves, but the reliability of electrical connection deteriorates
Solution Approach 1:
The vertical protrusion of the boss layer compensates for the reduced film thickness by providing geometric advantage. The thinner connection electrode achieves adequate electrical connection reliability through the elevated position provided by the boss, maintaining production efficiency while ensuring connection quality.
6Device complexity
If the existing manufacturing process is used, then the structure is simple, but the etching difficulty increases and production efficiency decreases
Solution Approach 1:
The patent segments the structure by introducing a separate boss layer distinct from the color filter layer and the electrode layers. This segmentation allows the boss layer to perform its specific function of elevation without complicating the other layers, maintaining overall structural simplicity while enabling thinner connection electrodes and improved production efficiency.
Data Source
Figure 1~3(a)
Figure 3(b)~5(a)
Figure 5(b)~5(d)
AI summary
An electroluminescent device and its manufacture method are disclosed. The electroluminescent device comprises a color film substrate (20) comprising a substrate (21) and a color filter layer, a boss layer (27), a first electrode (24), an organic electroluminescence layer (25) and a second electrode (26) disposed on the substrate (21); said color filter layer comprises a black matrix (221) and color blocks (222) separated by the black matrix (221); said boss layer (27) is disposed between said color filter layer and said first electrode (24), and the boss layer located above the color blocks (222) protrudes towards the side away from the substrate (21) to form a boss (271); said first electrode (24), said organic electroluminescence layer (25) and said second electrode (26) are disposed on the boss layer (27) orderly, and the second electrode (26) is located above said boss (271). In this electroluminescent device, the reliability of the electrical connection between the thin film transistors and the second electrode can be assured, and the etching difficulty during the manufacture process can be reduced, thereby improving the production efficiency.