Power Module Liquid Cooling Through a Conductive Bottom Housing
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Solution Overview
Problem
Existing charging devices face challenges in effectively dissipating heat generated during high-power ultra-fast charging of electric vehicles, leading to reduced performance and increased costs due to inefficient heat dissipation systems.
Innovation Solution
A power module with a liquid cooling plate assembly thermally connected to a circuit board assembly through a bottom housing, providing enhanced heat dissipation and water/electricity isolation, utilizing a sheet metal bottom housing fabricated via stamping molding for improved thermal conductivity and reduced component usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If air cooling heat dissipation is used, then the heat dissipation system cost is reduced, but the heat dissipation efficiency is insufficient for high-power operation
Solution Approach 1:
The patent applies liquid cooling technology by introducing a liquid cooling plate assembly with cooling channels that circulate cooling liquid to efficiently remove heat from power devices during high-power operation, replacing insufficient air cooling methods
Solution Approach 2:
The patent combines the liquid cooling plate assembly with the bottom housing into an integrated structure, where the bottom housing serves both as mechanical support and as part of the heat dissipation system, reducing overall system complexity while maintaining high heat dissipation efficiency
2Loss of energy
If liquid cooling plate assembly is placed inside the bottom housing, then thermal connection is improved, but water and electricity isolation becomes problematic
Solution Approach 1:
The liquid cooling plate assembly is fastened to the outer surface of the bottom housing, merging the heat dissipation function with the structural housing while maintaining water and electricity isolation through the housing barrier
Solution Approach 2:
The bottom housing serves as an intermediary thermal conduction path between the power devices and the liquid cooling plate assembly, enabling efficient heat transfer while maintaining electrical isolation and preventing water leakage risks
3Stability of the object's composition
If separate support structure is added for circuit board assembly, then structural stability is improved, but component quantity and cost increase
Solution Approach 1:
The bottom housing is designed to simultaneously serve as the support structure for the circuit board assembly and as part of the liquid cooling system, eliminating the need for separate support components and reducing overall system complexity while maintaining structural stability
Solution Approach 2:
The bottom housing performs multiple functions including mechanical support for the circuit board assembly, thermal conduction path for heat dissipation, and structural framework for the entire power module, reducing the need for additional components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves efficient liquid cooling heat dissipation, ensuring safety and stability, reducing costs, and enabling high-power operation with a charging speed of one kilometer per second, meeting the requirements of full-liquid cooling ultra-fast charging stations.
Implementation Method 1
the liquid cooling plate assembly is configured to be thermally connected to the plurality of power devices through the bottom housing
Implementation Method 2
A cooling medium in the liquid cooling plate assembly may exchange heat with the power device through the bottom housing, to implement liquid cooling heat dissipation
Data Source
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AI summary
Embodiments of this application provide a power module and a charging device. The power module includes a bottom housing, a circuit board assembly fastened in the bottom housing, and a liquid cooling plate assembly fastened outside the bottom housing. The circuit board assembly includes a circuit board and a plurality of power devices, and the plurality of power devices are fastened to a surface of the circuit board. The liquid cooling plate assembly is located on a side that is of the plurality of power devices and that is away from the circuit board, and the liquid cooling plate assembly is configured to be thermally connected to the plurality of power devices through the bottom housing, to implement liquid cooling heat dissipation for the plurality of power devices. Further, in embodiments of this application, heat dissipation effect on the power device in the power module can be improved, and heat dissipation costs of the power module can be reduced, thereby meeting a heat dissipation requirement of the power device during high-power operation, and improving a service life and reliability of the power module during high-power operation.