Cooling/Ventilation/Heating Modifications TRIZ Cases
- Control-Device Cooling Arrangement With Tolerance Compensation
A recessed heatsink and tolerance-compensating material align cooled components while limiting temperature loss across thermal interfaces.
- Hybrid Immersion and Direct-to-Chip Cooling for High-Power IT Components
Combining immersion coolant with direct-contact cold plates, this IT chassis case addresses limited cooling capacity for high-power CPUs and GPUs.
- Modular Coolant Distribution Units for Low-Loss Data Rack Cooling
Modular CDUs isolate facility and rack cooling loops while adjusting flow to limit pressure drops and energy use.
- Segmented Thermal Bridge Plates for Conformable Heat Transfer
Segmented upper and lower plates conform to surface variations, increasing thermal contact between electrical components and heat transfer devices.
- Power Module Cooling Assembly With Deep-Drawn Half-Shells
Deep-drawn half-shells and a materially bonded connection form a sealed cooling channel, reducing pressure loss and assembly complexity.
- Sidecar Liquid Cooling With Sensor-Based Flow Control
Temperature and flow sensors drive pump and fan controls around a heat exchanger to stabilize liquid cooling for data-center electrical equipment.
- Modular Coolant Distribution Units for Low-Drop Data Center Cooling
Independent modular CDUs divide coolant flow to reduce pressure drops and energy waste while maintaining data center rack cooling.
- Per-Tenant Liquid Cooling Redundancy for Chassis Thermal Isolation
Separate manifolds and redundant cooling units isolate tenant chassis loads, while pressure-balancing valves regulate flow for reliable operation.
- Oblique-Channel Heatsink for Uniform High-Power Chip Cooling
Oblique channels and separators guide refrigerant bubbles toward fin tops, improving heat spreading and reducing uneven temperatures.
- Two-Phase Immersion Cooling Volume Control for Stable Warmed Liquid Output
Fluctuating data-center heat loads destabilize warmed liquid output, so feedback adjusts ambient volume to regulate boiling and support consistent downstream heating.
- Liquid Line Routing Assembly for Tight IT Enclosure Cooling
Tight IT enclosure spaces complicate coolant-line connections; modular openings and pivoting gates simplify routing and maintenance.
- Domain Controller Heat Dissipation with Elastic Chip Contact
An elastic member presses a heat dissipation boss against the chip while housing support reduces circuit-board stress and cracking risk.
- Immersion Cooling Bellows Placement to Reduce Operating Fluid Volume
Bellows inside the tank head space compensate for pressure changes while condensers return vapor as liquid and reduce fluid volume.
- Modular PCB Cooling Assembly With Spring-Biased Heat Sinks
Spring-biased heat sinks press against coolant-channel walls, enabling protected PCB servicing without professional disassembly.
- Display Assemblies With Closed-Loop Turbulent Flow Cooling
Closed-loop fan units circulate gas through rear passageways to improve heat exchange while laminar flow preserves a flat display layer.