Modular PCB Cooling Assembly With Spring-Biased Heat Sinks
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Solution Overview
Problem
Existing liquid cooling systems for electronics require professional disassembly and lack ease of assembly and disassembly, and do not provide adequate mechanical protection for PCB components.
Innovation Solution
A modular enclosure system with spring-pressed enclosures that allow easy installation and replacement, utilizing a cold box with channels for liquid coolant flow and a pump for circulation, enabling end-user servicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented in existing products, then heat dissipation effectiveness is improved, but ease of assembly and disassembly deteriorates requiring professional servicing
Solution Approach 1:
The cooling system is divided into separate modular enclosures that can be independently installed and removed from the cold box. Each enclosure is a self-contained unit with its own heat sink and electronic components, allowing users to service or replace individual modules without affecting the entire cooling system.
Solution Approach 2:
The modular enclosure design enables end-users to perform assembly and disassembly operations themselves without requiring professional technical expertise. The simplified interface and independent modular units allow users to service the cooling system independently, eliminating the need for professional technicians.
2Temperature
If liquid cooling systems are designed with complex internal structures, then heat dissipation performance is improved, but device complexity increases making user servicing difficult
Solution Approach 1:
The complex cooling system is segmented into multiple simple, standardized modular enclosures. Each enclosure maintains the necessary internal complexity for effective heat dissipation through its heat sink and coolant channel design, while the overall system complexity is managed through modular architecture that simplifies user interaction and servicing.
Solution Approach 2:
The modular enclosures are designed with universal interfaces that allow the same basic enclosure design to serve multiple functions and configurations. The standardized mounting interface and modular architecture enable various electronic components to be installed in the same enclosure type, reducing overall device complexity while maintaining heat dissipation performance.
3Ease of repair
If modular enclosures are designed for easy replacement, then ease of repair is improved, but mechanical protection for PCB components may be compromised
Solution Approach 1:
The modular enclosure design segments the protective function from the electronic components. The enclosure itself serves as a protective barrier for PCB components during normal operation, while the modular nature allows for easy replacement if damage occurs. The heat sink and mounting structure provide mechanical support and protection while maintaining replaceability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy servicing and effective heat dissipation from electronics without specialized training, ensuring mechanical protection and efficient heat transfer.
Implementation Method 1
The cold box includes a plurality of springs each biasing a respective heat sink of a respective modular electronics enclosure against a corresponding one of the walls
Implementation Method 2
Each of the recesses is at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant
Implementation Method 3
The cold box may provide channels for liquid coolant to flow through the walls of the cold box
Implementation Method 4
A pump is in fluid communication with the channel and the radiator. The pump circulates the liquid coolant through the channel and the radiator
Implementation Method 5
A radiator is in fluid communication with the channel
Implementation Method 6
The pump circulates the liquid coolant through the channel and the radiator
Data Source
AI summary
A cooling arrangement for electronics includes a plurality of modular electronics enclosures. Each modular electronics enclosure includes at least one electronic component, and a heat sink engaging the electronic component. The cooling arrangement also includes a cold box having a plurality of recesses. Each of the recesses is at least partially defined by at least one corresponding wall having at least one channel therein carrying liquid coolant. Each of the recesses receives a respective one of the modular electronics enclosures. The cold box includes a plurality of springs each biasing a respective heat sink of a respective modular electronics enclosure against a corresponding one of the walls.