Segmented Thermal Bridge Plates for Conformable Heat Transfer

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Solution Overview

Problem

Existing thermal management systems face inefficiencies in heat dissipation due to limited thermal interface areas and variations in surface flatness, leading to degraded performance and potential damage of electrical components.

Innovation Solution

A thermal bridge assembly comprising segmented upper and lower plate stacks with spring elements and a bridge frame, allowing for conformable thermal coupling between electrical components and heat transfer devices, enhancing thermal energy transfer through compressible and conformable segments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If traditional heat sinks are used with fixed thermal interfaces, then the structure is simple, but thermal energy transfer efficiency is reduced due to limited interface area and surface flatness variations

Engineering Contradiction:
Improvethermal energy transfer efficiencyVSAvoidthermal bridge assembly complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The thermal bridge assembly is divided into multiple segmented plates (first set of plates and second set of plates) that can independently conform to surface variations. Each plate segment can adapt to local surface irregularities, maximizing thermal interface area and improving heat transfer efficiency while maintaining manageable structural complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The segmented plates are designed to be movable relative to each other, allowing the thermal bridge assembly to dynamically adapt its configuration to match the contours of the electrical component and heat transfer device surfaces. This dynamic adjustment capability enables optimal thermal contact without requiring a completely complex rigid structure

Inventive Principle:
Principle #15Dynamics

2Loss of energy

If rigid thermal coupling is used, then structural stability is maintained, but thermal contact efficiency decreases due to inability to conform to surface variations

Engineering Contradiction:
Improvethermal contact efficiencyVSAvoidthermal interface stability
Core Design Contradiction:
Loss of energyVSStability of the object's composition

Solution Approach 1:

The segmented plates are designed to be movable relative to each other, allowing the thermal bridge assembly to dynamically adapt its configuration to match the contours of the electrical component and heat transfer device surfaces. This dynamic adjustment capability enables optimal thermal contact without requiring a completely complex rigid structure

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent combines rigid plate structures with flexible segmentation and spring elements to create a hybrid system that achieves both structural stability and conformability. The plates maintain structural integrity while their segmented arrangement and spring mechanisms enable adaptation to surface variations, merging the benefits of rigid and flexible designs

Inventive Principle:
Principle #5Merging (Combining)

3Loss of energy

If spring elements are added to provide conformable coupling, then thermal contact is improved, but the risk of plates spreading apart increases

Engineering Contradiction:
Improvethermal contact maintenanceVSAvoidplate assembly structural integrity
Core Design Contradiction:
Loss of energyVSStrength

Solution Approach 1:

The thermal bridge assembly is divided into multiple segmented plates (first set of plates and second set of plates) that can independently conform to surface variations. Each plate segment can adapt to local surface irregularities, maximizing thermal interface area and improving heat transfer efficiency while maintaining manageable structural complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Spring elements are introduced as intermediary components between the plate segments to provide controlled elastic forces. These springs act as mediators that allow the plates to conform to surface variations while preventing excessive spreading, maintaining both thermal contact and structural integrity through controlled elasticity

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The thermal bridge assembly improves thermal energy transfer efficiency by conforming to the shapes of electrical components and heat transfer devices, maintaining effective thermal contact and reducing the risk of component degradation.

Implementation Method 1

The spring element includes an upper spring member engaging the upper plates to bias the upper plates with an opening force generally away from the lower plates. The spring element includes a lower spring member engaging the lower plates to bias the lower plates with an opening force generally away from the upper plates.

Methodology Applied
Scientific EffectSpring: Spring

Implementation Method 2

The outer ends of the lower plates configured to face and thermally couple to an electrical component. The sides of some of the lower plates face the sides of some of the upper plates to thermally interface the lower plates with the upper plates.

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250324552A1Thermal bridge for an electrical component
Publication Date: 2025.10.16 TE CONNECTIVITY SOLUTIONS GMBH
  • US20250324552A1 patent drawing
  • US20250324552A1 patent drawing
  • US20250324552A1 patent drawing

AI summary

A thermal bridge includes an upper bridge assembly including upper plates and a lower bridge assembly including lower plates. The upper and lower plates are segmented including forward segments and rearward segments meeting at a seam. The ends of the lower plates face and thermally couple to an electrical component. The sides of some of the lower plates face the sides of some of the upper plates to thermally interface the lower plates with the upper plates. The thermal bridge includes a spring element positioned between the upper bridge assembly and the lower bridge assembly. The thermal bridge includes a bridge frame supporting the upper plates and the lower plates. The bridge frame includes open limit spars engaging the plates at the seam to limit spreading apart of the plates from each other against the opening forces of the spring element.