Control-Device Cooling Arrangement With Tolerance Compensation

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Solution Overview

Problem

Existing cooling systems for electronic control units in vehicles face challenges in efficiently dissipating heat from high-performance processors while minimizing temperature drops across thermal interface materials, leading to thermal stress on adjacent components and performance restrictions.

Innovation Solution

A cooling arrangement with a heatsink and tolerance-compensating material that reduces or eliminates the need for thick thermal interface materials by mechanically aligning the heatsink and component to be cooled, using a hardening material for fixation and a flexible second thermal component for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thick thermal interface materials are used to compensate for tolerances, then mechanical alignment and thermal coupling are achieved, but temperature drops increase and heat transfer efficiency decreases

Engineering Contradiction:

Improvethermal coupling reliabilityVSAvoidtemperature drop

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The patent divides the thermal interface into two functional segments: a thin thermal interface material layer for thermal coupling and a separate mechanical alignment structure (recess with positioning elements) for mechanical alignment. This segmentation allows each layer to optimize its specific function without compromising the other, reducing overall thermal resistance while maintaining reliable mechanical coupling.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary mechanical alignment structure (recess with positioning elements) that mediates between the heatsink and the component to be cooled. This intermediary structure ensures precise alignment and reliable thermal coupling without requiring thick thermal interface materials, thereby reducing temperature drops while maintaining coupling reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Speed

If high-performance processors are placed close to heat-sensitive components, then fast data transfer speeds are achieved, but thermal stress on adjacent components increases

Engineering Contradiction:

Improvedata transfer speedVSAvoidthermal stress

Core Design Contradiction:

SpeedVSObject-affected harmful factors

Solution Approach 1:

The patent segments the cooling system into multiple independent cooling zones: a first cooling zone for the high-performance processor and a second cooling zone for heat-sensitive components. This segmentation allows the processor to be positioned close to sensitive components for fast data transfer while maintaining separate thermal management zones that prevent thermal stress on adjacent components.

Inventive Principle:

Principle #1Segmentation

3Reliability

If multiple thermal interface layers are used to ensure thermal coupling, then thermal contact is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvethermal contact reliabilityVSAvoidnumber of thermal interface layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts the mechanical alignment function from the thermal interface layers and implements it through a dedicated mechanical structure (recess with positioning elements). This extraction allows the thermal interface to be simplified to a single thin layer, reducing device complexity while maintaining reliable thermal contact through the improved mechanical alignment and reduced number of interfaces.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively transfers heat with minimal temperature loss, protecting sensitive components from mechanical stress and improving thermal performance by reducing the thickness and number of thermal interface layers.

Implementation Method 1

a first thermal component which is arranged on the component to be cooled... the first thermal component and the component to be cooled are thermally coupled

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a tolerance-compensating material which brings about the fixing of the first thermal component

Methodology Applied

Scientific EffectMechanical fixation: Mechanical Fastener

Implementation Method 3

a second thermal component which is arranged on the first thermal component... for enhanced heat dissipation

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250324555A1Cooling arrangement, control device, heatsink and production process

Publication Date: 2025.10.16 CONTINENTAL AUTONOMOUS MOBILITY GERMANY GMBH

AI summary

A cooling arrangement comprising a housing of a control device or a sensor, a component to be cooled arranged in the housing of the cooling arrangement, a first thermal component arranged on the component to be cooled. The housing has a recess into which the first thermal component is inserted in such a way that the first thermal component is mechanically aligned with the component to be cooled and is thermally coupled thereto, and a tolerance-compensating material is provided between the first thermal component and the housing.