Power Module Cooling Assembly With Deep-Drawn Half-Shells

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Solution Overview

Problem

Existing power module cooling systems in the automotive sector face inefficiencies due to complex geometric designs, additional seals causing pressure loss and dead water zones, and require multiple fastening elements, leading to increased complexity and potential damage from overheating.

Innovation Solution

A structural unit for power modules with a cooling channel formed by deep-drawn half-shells and bridging pieces, eliminating the need for seals and fastening elements by using a materially bonded connection, ensuring efficient thermal dissipation and simplified assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If seals are used to close the cooling channel between the power module and the cooling channel, then sealing effect is achieved, but pressure loss and dead water zones occur

Engineering Contradiction:
Improvesealing effectVSAvoidpressure loss
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent removes the seals from the cooling channel system entirely. Instead of using seals to close the cooling channel, the design allows the cooling channel to be open at the location where the power module is mounted, eliminating the sealing requirement and the associated pressure loss and dead water zones.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The cooling channel is segmented into different sections: an inlet section, a mounting section for the power module, and an outlet section. The mounting section is designed to be open rather than sealed, allowing direct thermal contact between the power module and cooling channel while maintaining coolant flow.

Inventive Principle:
Principle #1Segmentation

2Strength

If multiple fastening elements and seals are used to secure the power module, then mechanical fastening is achieved, but device complexity increases

Engineering Contradiction:
Improvemechanical fasteningVSAvoidcomponent complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent combines the mounting function and the cooling function into a single integrated structure. The power module is mounted directly to the housing with thermal contact to the cooling channel, eliminating the need for separate fastening elements and seals. The housing itself serves as both the structural support and the cooling pathway.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The housing structure serves multiple functions simultaneously: it provides mechanical support, defines the cooling channel pathway, and enables thermal contact between the power module and coolant. This multi-functionality reduces the number of separate components needed.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If thermal transitions and conductive paths are introduced between the power module and coolant, then thermal connection is achieved, but thermal transition efficiency decreases

Engineering Contradiction:
Improvethermal connectionVSAvoidthermal transition efficiency
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent removes intermediate thermal transitions by allowing direct contact between the power module and the cooling channel. The cooling channel is positioned to be in direct thermal contact with the power module's heat-generating components, eliminating the need for separate thermal paths or conductive materials that would add thermal resistance.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces pressure loss, minimizes thermal obstacles, and simplifies assembly by integrating the power module components into a single, sealed, and efficiently cooled system, reducing the risk of overheating and assembly errors.

Implementation Method 1

The power semiconductors are applied to the surface of the cooling channel by way of a suitable method, e.g. by being attached via a thermally conductive material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the cooling channel is sealed off from the power semiconductors... the cooling channel having an inlet and outlet

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the cooling channel is closed in a materially bonded manner between the power module and the upper half-shell

Methodology Applied
Scientific EffectMaterial bonding: Welding

Data Source

PatentUS20250324540A1Assembly for power modules and mounting method for the assembly for power modules
Publication Date: 2025.10.16 MAGNA POWERTRAIN AG & CO KG
  • US20250324540A1 patent drawing
  • US20250324540A1 patent drawing
  • US20250324540A1 patent drawing

AI summary

An assembly for power modules includes at least one power module and a cooling channel having an inlet and an outlet. The cooling channel is formed by a lower half shell and an upper half shell and the power electronics system has cooling fins which protrude into the cooling channel through respective cut-outs. The cooling channel is integrally sealed between the power module and the upper half shell, and the lower half shell and the upper half shell are produced by deep drawing, with at least one bridging piece interconnecting them.