Domain Controller Heat Dissipation with Elastic Chip Contact
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Solution Overview
Problem
Existing solutions to improve heat dissipation in domain controllers increase stress on chips and circuit boards, posing a risk of cracking.
Innovation Solution
A domain controller design with an elastic member compressing a heat dissipation boss against a chip and a supporting portion on the housing to reduce stress, combined with a thermal conductive layer to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the gap between heat sink and chip is compressed to reduce thermal conductive layer thickness, then heat dissipation performance is improved, but stress on chip and circuit board increases causing cracking risk
Solution Approach 1:
The patent divides the heat dissipation system into multiple independent heat dissipation bosses (first heat dissipation boss for first chip, second heat dissipation bosses for second chips) rather than using a single unified heat sink. This segmentation allows each boss to independently contact its corresponding chip with optimized pressure, improving heat dissipation efficiency while distributing and reducing stress on the circuit board and chips.
Solution Approach 2:
The patent applies different thermal conductive layer thicknesses to different locations based on local heat dissipation needs. The first thermal conductive layer between the first heat dissipation boss and first chip has a different thickness than the second thermal conductive layer between second heat dissipation bosses and second chips. This local optimization ensures effective heat dissipation while minimizing stress in each specific area.
2Temperature
If thermal conductive layer thickness is reduced to improve heat transfer, then heat dissipation efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs elastic members that can dynamically adjust and compensate for dimensional variations and assembly tolerances. The elastic deformation of these members allows the heat dissipation bosses to maintain optimal contact with chips despite manufacturing variations, reducing the stringency of precision requirements while ensuring effective thermal contact.
Solution Approach 2:
The patent changes the physical state and dimensions of the elastic members based on assembly conditions. The elastic members are designed with specific elastic moduli and dimensions that allow them to deform within a controlled range, transforming rigid dimensional requirements into flexible elastic deformation parameters. This approach maintains effective thermal contact while accommodating manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces stress on chips and circuit boards, minimizing the risk of cracking while improving heat dissipation efficiency.
Implementation Method 1
an elastic member in a compressed state, where a first end of the elastic member abuts against the housing and a second end of the elastic member abuts against the heat dissipation assembly
Implementation Method 2
enabling the first heat dissipation boss to abut against the first chip
Data Source
Figure 1~2
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AI summary
The present application provides a domain controller and a mobile platform. The domain controller includes a housing, where a heat dissipation assembly and a circuit board are stacked inside the housing, a side of the circuit board facing the heat dissipation assembly is provided with a first chip, the heat dissipation assembly is provided with a first heat dissipation boss, a side of the heat dissipation assembly facing away from the circuit board is further provided with an elastic member in a compressed state, where a first end of the elastic member abuts against the housing and a second end of the elastic member abuts against the heat dissipation assembly, enabling the first heat dissipation boss to abut against the first chip, and the housing is provided with a supporting portion and the supporting portion abuts against the circuit board. In the present application, the elastic member in the compressed state is provided at the side of the heat dissipation assembly facing away from the circuit board, so that the first heat dissipation boss tightly abuts against the first chip with a reduced distance between the first heat dissipation boss and the first chip. The corresponding supporting portion is provided on the housing to support the circuit board, thereby reducing the stress borne by the circuit board and reducing the risk of cracking of the first chip.