Hybrid Immersion and Direct-to-Chip Cooling for High-Power IT Components
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Solution Overview
Problem
Existing immersion cooling methods for IT systems face limitations in cooling capacity, especially for high-power components like CPUs and GPUs, due to physical space and budget constraints, leading to overheating issues.
Innovation Solution
A hybrid cooling system combining immersion and direct-contact cooling, utilizing a chassis with an enclosure for immersion coolant and a cold plate for direct coolant, featuring a movable flap for overflow control and separate conduits for coolant delivery and drainage, enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion cooling is used for IT systems, then cooling coverage for all components is improved, but cooling capacity for high-power components like CPUs and GPUs is insufficient
Solution Approach 1:
The cooling system is segmented into two distinct zones: a first region for immersion cooling of general components and a second region for direct-contact cooling of high-power components. This segmentation allows each region to be optimized for its specific cooling needs, with the direct-contact region providing enhanced cooling capacity for high-power components while the immersion region handles general component cooling.
Solution Approach 2:
Different cooling methods are applied to different regions based on local requirements. High-power components receive direct-contact cooling through cold plates in contact with heat generation sources, while other components receive immersion cooling. This local differentiation ensures that cooling capacity is concentrated where it is most needed.
2Temperature
If immersion cooling is implemented, then overall cooling coverage is improved, but physical space and budget constraints are severely limited
Solution Approach 1:
The cooling system divides the server chassis into multiple regions with different cooling approaches. By segmenting the cooling architecture, the system can use compact direct-contact cooling for high-power components rather than requiring full immersion cooling for all components, thereby reducing overall space requirements while maintaining comprehensive cooling coverage.
3Device complexity
If immersion cooling is used, then cooling simplicity is improved, but cooling capacity for highly-localized power components is limited
Solution Approach 1:
The cooling system is divided into simple immersion cooling for general components and targeted direct-contact cooling for high-power components. This segmentation maintains overall system simplicity while providing enhanced cooling capacity where needed, as the direct-contact region can be integrated into the existing immersion cooling architecture without requiring a complete system redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid system effectively addresses overheating by providing enhanced cooling capacity for high-power components, optimizing space utilization and budget efficiency.
Implementation Method 1
The cooling liquid acts as a medium for dissipating heat generated from the components of the IT system
Implementation Method 2
The cooling liquid acts as a medium for dissipating heat generated from the components of the IT system
Implementation Method 3
a cold plate positioned within the enclosure and configured for mounting in direct contact with at least one of the heat-generating components
Data Source
AI summary
A hybrid cooling system is configured to receive heat-generating components of an information technology (IT) device. The system includes a chassis having a peripheral wall that extends between a chassis base and an open top surface, the peripheral wall forming an enclosure between an upstream side and a downstream side. An immersion conduit delivers an immersion coolant and fills the enclosure to fully immerse the heat-generating components. An outlet duct drain overflow of the immersion coolant accumulated in the enclosure. A cold plate within the enclosure is configured for direct contact with at least one heat-generating component. A supply conduit delivers a direct coolant in cooled form within the cold plate, and is in flow communication with a cold plate inlet connector. A return conduit removes the direct coolant in heated form from the cold plate, and is in flow communication with a cold plate outlet connector.