Bridge Chip Command Routing for Memory Latency
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Solution Overview
Problem
The existing semiconductor devices experience latency and reduced data transfer rates due to the bridge chip's signal processing latency, leading to inefficient bus usage and prolonged operation times for memory chips, especially when using standard protocols without vendor-specific commands.
Innovation Solution
The semiconductor device incorporates a bridge chip that can receive a specific signal from the host to interpret subsequent commands as intended for itself, preventing unnecessary operations in memory chips and allowing for improved data transfer by switching between operation modes based on the bridge chip enable signal, thereby optimizing data transfer rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a bridge chip is used to connect the host and memory chips, then the system can access multiple memory chips, but the bridge chip's signal processing latency reduces the data transfer rate
Solution Approach 1:
The bridge chip acts as an intermediary between the host and multiple memory chips, enabling the host to access multiple memory chips through a single interface while managing signal routing and processing
Solution Approach 2:
The bridge chip dynamically switches between two operational modes based on a control signal: in the first mode, it transfers commands from the host to memory chips; in the second mode, it interprets commands for itself, thereby optimizing data transfer rates by adapting its behavior to the current operational requirements
2Ease of operation
If the bridge chip transfers all commands to memory chips, then memory chips can be accessed, but unintended operations occur in memory chips when commands are actually for the bridge chip
Solution Approach 1:
The bridge chip uses a control signal mechanism to determine whether to transfer or interpret commands, creating a feedback loop that ensures commands are routed to the correct destination and prevents unintended memory chip operations
Solution Approach 2:
The bridge chip dynamically changes its operational mode based on the control signal, switching between command transfer mode and command interpretation mode to ensure accurate command routing and prevent unintended operations in memory chips
3Adaptability or versatility
If standard protocols are used without vendor-specific commands, then compatibility is maintained, but data transfer rates remain limited due to protocol overhead
Solution Approach 1:
The bridge chip changes the operational parameters of the system by switching between two modes: one that maintains standard protocol compatibility for broad adaptability, and another that optimizes for higher data transfer rates by interpreting commands directly without full protocol overhead
Data Source
AI summary
A semiconductor device includes a first chip, a plurality of second chips, and a plurality of first signal lines. The first chip is electrically connected to a terminal group that receives a first signal from a host. The second chips are electrically connected to the first chip and are capable of outputting respective ready/busy signals. The ready/busy signals can be transferred through the first signal lines. Each of the second chips is respectively connected to the first chip through a corresponding first signal line among the plurality of first signal lines.