Bridge-Chip Electronic Package for Shorter Optical Signal Paths
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Solution Overview
Problem
Existing semiconductor packages for optical communication suffer from excessively long electrical signal transmission paths, leading to data loss and increased power consumption, which cannot meet the rapid data transmission demands of emerging technologies.
Innovation Solution
An electronic package design featuring a bridge chip with a wiring structure, where an electronic component and an optical engine are electrically connected via the bridge chip, incorporating a packaging structure and optical chip module, with a manufacturing process involving multiple carriers and encapsulation layers to facilitate efficient electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is disposed on the substrate and the optical transceiver module is disposed on the circuit board, then the optical communication function is achieved, but the electrical signal transmission path becomes excessively long resulting in data loss and increased power consumption
Solution Approach 1:
The patent merges the semiconductor chip and optical transceiver module onto a single substrate, eliminating the need for separate mounting on different boards. This integration directly shortens the electrical signal transmission path by removing intermediate connection layers and reducing the physical distance between components, thereby resolving the contradiction between transmission reliability and path length.
Solution Approach 2:
The patent transitions from a distributed three-dimensional layout (chip on substrate, module on separate circuit board) to a planar two-dimensional integration on a single substrate. This dimensional reorganization reduces the vertical and horizontal distances that electrical signals must travel, effectively shortening the transmission path while maintaining all necessary functional connections.
2Productivity
If the electrical signal transmission path is simplified by disposing components on the substrate, then the transmission path length is reduced, but the data transmission capacity cannot cope with rapid growth requirements
Solution Approach 1:
The patent replaces electrical signal transmission with optical signal transmission by integrating an optical transceiver module directly on the substrate. This substitution eliminates the limitations of electrical transmission paths, enabling much higher data transmission capacities while keeping the physical footprint compact. The optical interface allows for significantly increased bandwidth and data rates compared to traditional electrical connections.
3Use of energy by stationary object
If the electrical signal transmission path is excessively long, then the power consumption increases, but shortening the path requires redesigning the package structure
Solution Approach 1:
The patent combines multiple previously separate components (semiconductor chip, substrate, optical transceiver module) into a single integrated package structure. This merging eliminates long external interconnections and reduces the overall package complexity by creating a unified design where components work together within a compact architecture, thereby reducing power consumption without requiring complex external routing.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which a bridge chip is disposed on one side of a wiring structure, and an electronic component and an optical engine are disposed on the other side of the wiring structure. The bridge chip, the electronic component and the optical engine are electrically connected to the wiring structure, so that the electronic component and the optical engine can be electrically connected to each other via the bridge chip, such that the path of electrical transmission is shortened and the loss and power consumption of data transmission are reduced.