Bridge Device Architecture for Discrete Memory Integration
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Solution Overview
Problem
Current memory devices, particularly flash memory, face limitations in I/O bandwidth and read/write throughput, which hinder their performance and increase the form factor size and weight of consumer electronics, necessitating the development of high-performance memory devices with enhanced flexibility and integration.
Innovation Solution
A composite memory device comprising a bridge device and discrete memory devices, where the bridge device converts global memory control signals into local control signals compatible with discrete memory devices, enabling efficient operation and integration in various memory systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If flash memory devices are used to provide large amounts of non-volatile storage, then storage capacity is improved, but I/O bandwidth and read/write throughput deteriorate
Solution Approach 1:
The memory system is segmented into multiple discrete memory devices (e.g., four separate flash memory chips) that are connected in parallel through a bridge device. This segmentation allows the system to achieve high storage capacity while maintaining high I/O bandwidth by distributing data across multiple independent memory units, each capable of simultaneous access.
Solution Approach 2:
A bridge device is introduced as an intermediary component between the host system and the discrete memory devices. The bridge device manages the interface between the single I/O interface and multiple memory devices, enabling parallel data transfer and converting serial data into parallel data to significantly improve read/write throughput while maintaining compatibility with existing flash memory protocols.
2Quantity of substance
If more physical memory is included in consumer electronics, then memory capacity is improved, but form factor size and weight increase
Solution Approach 1:
Multiple discrete memory devices are merged into a single integrated memory module through the bridge device architecture. The parallel connection of multiple memory chips within a compact package provides high storage capacity while occupying minimal space, effectively combining the functionality of multiple separate components into one space-efficient unit suitable for portable electronics.
3Ease of manufacture
If discrete memory devices are used, then manufacturing flexibility and cost are improved, but integration level and I/O bandwidth deteriorate
Solution Approach 1:
The bridge device serves multiple functions: it acts as a controller for the discrete memory devices, provides data buffering, enables parallel data transfer, and interfaces with the host system. This multi-functional design allows the system to maintain the manufacturing advantages of discrete components while achieving high integration level and bandwidth through the bridge's coordinated management of multiple devices.
Data Source
AI summary
A composite memory device including discrete memory devices and a bridge device for controlling the discrete memory devices in response to global memory control signals having a format or protocol that is incompatible with the memory devices. The discrete memory devices can be commercial off-the-shelf memory devices or custom memory devices which respond to native, or local memory control signals. The global and local memory control signals include commands and command signals each having different formats. The composite memory device includes a system in package including the semiconductor dies of the discrete memory devices and the bridge device, or can include a printed circuit board having packaged discrete memory devices and a packaged bridge device mounted thereto.