Semiconductor Package Bridge Die Connection via Bending Wire
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Solution Overview
Problem
The existing semiconductor package manufacturing techniques require larger bridge dies and customized pad pitches due to the minimum distance constraints between copper pillars, leading to increased costs and manufacturing complexities, especially with the tolerance errors of pick and place machines and vacuum jigs.
Innovation Solution
The use of a connection component, such as a bonding wire or redistribution layer (RDL) with bendings, to connect pads of a bridge die to ICs, allowing for a larger horizontal distance between ICs without increasing the bridge die size, thereby facilitating the filling of molding compound without further design adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper pillars are used to connect bridge dies to ICs, then electrical connection is achieved, but the minimum distance between copper pillars (20 μm) forces larger bridge die size and increases manufacturing cost
Solution Approach 1:
The patent introduces a flexible connection component as an intermediary element between the bridge die and ICs. This connection component includes a first portion connected to the bridge die, a second portion connected to the IC, and a bending portion that provides flexibility. By using this intermediary flexible connector instead of rigid copper pillars, the bridge die size can be reduced while maintaining reliable electrical connection, as the flexible portion can accommodate larger distances between components without requiring larger pillar spacing.
Solution Approach 2:
The patent transitions from a rigid, direct linear connection (copper pillars) to a flexible, multi-dimensional connection path. The bending portion of the connection component introduces spatial flexibility, allowing the connection to extend in multiple directions and accommodate larger horizontal distances between the bridge die and ICs. This dimensional flexibility enables smaller bridge die sizes while maintaining connection reliability over larger distances.
2Reliability
If minimum distance between ICs is increased to accommodate copper pillar spacing, then electrical connection reliability is improved, but manufacturing cost increases due to larger bridge die size
Solution Approach 1:
The flexible connection component serves as a mediator that decouples the rigid distance constraints of traditional copper pillar connections. By introducing this flexible intermediary, the system can accommodate larger IC distances without requiring proportionally larger bridge die sizes, thereby reducing manufacturing costs while maintaining connection reliability.
Solution Approach 2:
The patent changes the physical state and properties of the connection from rigid (copper pillars with fixed minimum spacing) to flexible (bending portion with adjustable geometry). This parameter change allows the connection to adapt to varying distances between ICs without being constrained by fixed minimum spacing rules, enabling cost-effective manufacturing across different design scenarios.
3Manufacturing precision
If pick and place machine tolerance and vacuum jig error are accommodated by increasing IC distance, then positioning accuracy is improved, but bridge die size and manufacturing complexity increase
Solution Approach 1:
The patent introduces dynamic flexibility into the connection system through the bending portion of the connection component. This flexible element can dynamically adapt to positioning variations and tolerance errors from pick and place machines and vacuum jigs. Instead of requiring fixed, large spacing to accommodate errors, the flexible connection absorbs these variations, allowing smaller bridge die sizes and simpler designs while maintaining positioning accuracy.
Solution Approach 2:
The flexible connection component changes the mechanical parameters of the system from rigid fixed-spacing to flexible adaptive-spacing. This parameter change allows the connection to tolerate positioning errors and tolerance variations without requiring increased IC distance or larger bridge die designs, thereby reducing manufacturing complexity.
4Adaptability or versatility
If bridge die size is increased to accommodate larger IC distances, then connection flexibility is improved, but pad pitch design complexity increases due to case-by-case customization
Solution Approach 1:
The flexible connection component acts as an intermediary that absorbs the need for customized pad pitch designs. By placing the flexibility in the connection component rather than in the bridge die size, the system achieves adaptability without requiring case-by-case customization of pad pitches, thereby reducing design complexity.
Solution Approach 2:
The patent moves the flexibility requirement from the planar dimension (bridge die size and pad pitch) to the vertical/three-dimensional dimension (bending portion of the connection). This dimensional shift allows the connection to accommodate distance variations without requiring changes to the pad pitch layout, simplifying the design process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient electrical connection between bridge dies and ICs without enlarging the bridge die or pad pitch, reducing manufacturing costs and complexities while accommodating larger IC distances, thus improving the semiconductor package structure.
Implementation Method 1
connecting the second active surface of the second electronic component and the first active surface of the first electronic component using a bonding wire
Data Source
AI summary
A package structure includes a substrate, a first electronic component, a second electronic component, a third electronic component and a connection component. The substrate includes a first surface and a second surface opposite the first surface. The first electronic component is disposed at the substrate and has a first active surface exposed from the second surface of the substrate. The second electronic component includes a second active surface facing the first active surface of the first electronic component. The second active surface of the second electronic component is electrically connected to the first active surface of the first electronic component. The third electronic component includes a third active surface facing the first active face of the first electronic component. The connection component electrically connects the third active surface of the third electronic component to the first active surface of the first electronic component. The connection component has at least two bendings.