Bridge Die Interconnect for Multi-Substrate SoC Integration
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Solution Overview
Problem
Chips on different substrates in semiconductor devices face challenges in effective communication, necessitating improved electrical connectivity solutions.
Innovation Solution
A semiconductor device design featuring a bridge die that electrically connects two chips through a first and second layer structure, utilizing a silicon-based substrate with conductive vias and contacts, and encapsulation by molding compound to create a coplanar surface for enhanced connectivity and integration of passive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If chips are disposed on different substrates, then device integration is achieved, but electrical connectivity between chips becomes difficult
Solution Approach 1:
A bridge die is introduced as an intermediary component between two separately disposed chips on different substrates. The bridge die includes conductive vias and contacts that establish electrical pathways, enabling communication between chips that would otherwise be difficult to connect due to their spatial separation on different substrates.
Solution Approach 2:
The bridge die structure extends the electrical connection pathway into the vertical dimension through conductive vias that penetrate through the bridge die substrate. This three-dimensional approach allows electrical connectivity between chips on different substrates by utilizing vertical conduction paths rather than relying solely on planar connections.
2Reliability
If bridge die with conductive vias is used to connect chips, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The bridge die is prepared in advance with conductive vias and contacts formed during the substrate fabrication process, before the actual chip assembly takes place. This preliminary formation of conductive structures simplifies the subsequent assembly process, as the electrical pathways are already established and ready for chip integration.
3Reliability
If molding compound is used for encapsulation, then component protection is achieved, but heat dissipation becomes challenging
Solution Approach 1:
The bridge die substrate is constructed as a composite structure combining an insulating substrate material with integrated conductive vias. This composite design provides both the protective encapsulation function of the insulating material and the heat dissipation capability through the conductive via pathways, allowing simultaneous achievement of component protection and thermal management.
Data Source
AI summary
A semiconductor device includes a first layer structure, a second layer structure, a bridge die, a first SoC and a second SoC. The bridge die is disposed between the first layer structure and the second layer structure. The first SoC and the second SoC are disposed on the second layer structure. The first SoC and the second SoC are electrically connected through the bridge die.