Embedded Bridge Die Power Delivery Using Vertical Trench Interconnects
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Solution Overview
Problem
Existing embedded multi-die interconnect bridge (EMIB) structures face challenges in routing power delivery paths due to high resistance and inductance, which affect signal bandwidth and efficiency.
Innovation Solution
Implementing vertical interconnect structures within the interconnect bridge, combining conductive and dielectric materials to create a vertical power delivery path that reduces resistance and inductance, complementing existing horizontal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power delivery paths are routed in existing EMIB structures, then power can be delivered to the bridge die, but high resistance and inductance challenges occur
Solution Approach 1:
The patent introduces vertical power delivery paths that extend through the substrate beneath the bridge die, transitioning from traditional planar routing to three-dimensional routing. This vertical dimension allows power to be delivered from underneath the die rather than only through lateral paths, significantly reducing parasitic resistance and inductance by creating shorter, more direct current paths
Solution Approach 2:
The patent embeds conductive structures within trenches that are formed inside the substrate, creating nested configurations where conductive material is positioned within recesses in the substrate. This nesting approach allows power delivery paths to be integrated within the substrate structure itself, reducing the overall path length and parasitic effects while maintaining compact packaging
2Object-affected harmful factors
If vertical interconnect structures are implemented, then parasitic resistance and inductance are reduced, but fabrication complexity increases
Solution Approach 1:
The patent performs preliminary actions by forming trenches and depositing conductive material in the substrate before the bridge die is attached. This advance preparation creates ready-made vertical power delivery pathways that simply need to be connected to the die afterward, rather than requiring complex post-attachment modifications or advanced fabrication techniques
Solution Approach 2:
The patent uses trenches filled with conductive material as intermediary structures that mediate between the substrate and the bridge die. These intermediary conductive paths provide the vertical power delivery function without requiring direct integration of complex fabrication processes, serving as a bridge that simplifies the overall manufacturing approach
3Productivity
If high I/O density is achieved in EMIB structures, then signal bandwidth is improved, but power delivery routing becomes more difficult
Solution Approach 1:
By introducing vertical power delivery paths through the substrate, the patent separates power routing from signal routing in the lateral plane. This dimensional separation allows high-density I/O configurations to maintain their signal bandwidth while power can be delivered through dedicated vertical paths that do not compete for lateral routing resources
Solution Approach 2:
The patent segments the power delivery function from the signal routing function by creating dedicated vertical power paths through the substrate. This segmentation allows independent optimization of signal density in the lateral dimensions while power delivery is handled through the vertical dimension, reducing routing complexity for both functions
Data Source
AI summary
Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.