Bridge Fan-Out Packaging for Lower Trace Routing Density
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Solution Overview
Problem
Trace design in semiconductor packaging is limited due to spatial restrictions, leading to high trace routing density, difficulty in chip connections, increased short circuit and signal transmission errors, and limited I/O count.
Innovation Solution
A fan-out packaging device using a bridge for auxiliary connections between chips, with traces and connection terminals, reducing trace routing density and improving design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fan-out packaging is performed without a bridge structure, then the packaging process is simpler, but trace routing density is high and design freedom is limited
Solution Approach 1:
The packaging structure is segmented by introducing a bridge component that is separate from the main package body. The bridge acts as an independent auxiliary connection structure that can be selectively positioned and configured, allowing trace routing to be divided between the main package and the bridge, thereby reducing trace routing density and improving design freedom without substantially increasing overall complexity
Solution Approach 2:
The bridge serves as an intermediary component between the package body and external connections. It provides additional trace routing paths and connection points that mediate between the limited space within the package and the required external I/O connections, enabling more flexible trace design while maintaining a relatively simple overall packaging structure
2Device complexity
If trace routing is performed within the package body only, then the structure is simpler, but short circuit and signal transmission errors increase
Solution Approach 1:
The routing path is segmented into two separate structures: traces within the package body and traces on the bridge. This segmentation distributes the routing load, reduces trace density within the package body, and provides alternative pathways that reduce the risk of short circuits and signal transmission errors, thereby improving reliability without requiring a completely complex routing structure
Solution Approach 2:
The bridge extends the routing space into an additional dimensional domain outside the main package body. By utilizing this extra spatial dimension, the patent creates more routing pathways and reduces congestion within the package body, which decreases the probability of short circuits and signal errors while maintaining reasonable structural complexity
3Quantity of substance
If I/O count is increased within the package body, then connectivity is improved, but spatial restrictions cause design limitations
Solution Approach 1:
The bridge acts as an intermediary that extends the I/O capacity beyond the physical constraints of the package body. By placing connection terminals on the bridge, the system achieves higher effective I/O count without increasing the area of the package body itself, as the bridge utilizes external space for additional connections
Solution Approach 2:
The bridge utilizes external spatial dimensions beyond the package body boundaries to accommodate additional I/O connections. This dimensional extension allows the system to increase the effective I/O count without being constrained by the fixed area of the package body, enabling higher connectivity while maintaining compact package dimensions
Data Source
AI summary
Disclosed are a fan-out packaging device and a method of manufacturing the fan-out packaging device, and more particularly a fan-out packaging device using a bridge, the fan-out packaging device including a bridge formed at one side of a fan-out package having two or more dies integrated therein, at least one trace formed at the bridge, and a connection terminal formed at an end of the trace, the connection terminal being in contact with a contact terminal of the fan-out package, wherein the different dies integrated in the fan-out package are electrically connected to each other via the bridge.