Microelectronic Bridge Interconnects for High Density Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional microelectronic packages face limitations in interconnect density, signal transfer speed, and miniaturization due to costly and complex manufacturing operations required for high-density interconnects.
Innovation Solution
The use of a microelectronic structure with a substrate and a bridge component in a cavity, where the bridge component is coupled to the substrate using an adhesive, allowing for higher interconnect density without the need for expensive manufacturing operations like fine-pitch via formation and first-level interconnect plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional solder attachment methods are used to attach die to organic package substrate, then manufacturing process is simple, but interconnect density is limited and manufacturing cost increases for high-density requirements
Solution Approach 1:
The patent introduces a bridge component that extends in the Z-direction (vertical dimension) to provide interconnect pathways between different levels of the package. This three-dimensional interconnect structure allows signals to travel vertically through the bridge rather than requiring dense lateral routing on the substrate plane, thereby achieving high interconnect density without proportionally increasing manufacturing complexity
Solution Approach 2:
The patent divides the interconnect function into separate components: the substrate, the bridge component, and the die. The bridge component is segmented into multiple conductive traces that can be independently routed and connected to different pads on the die and substrate, enabling high-density interconnects through modular construction rather than requiring monolithic fine-pitch via formation
2Manufacturing precision
If fine-pitch via formation and first-level interconnect plating are used to achieve high interconnect density, then interconnect density increases, but manufacturing cost and process complexity increase significantly
Solution Approach 1:
The bridge component serves as an intermediary structure between the substrate and the die, providing conductive pathways without requiring direct fine-pitch vias through the entire package stack. The bridge component can be attached using conventional adhesive bonding or wire bonding techniques, avoiding the need for expensive multi-layer PCB fabrication processes including fine-pitch via formation and multiple plating steps
Solution Approach 2:
The bridge component replicates the interconnect function of conventional fine-pitch vias but uses a different physical implementation - wire bonds or trace patterns on a separate component rather than plated through-holes. This copying approach achieves the same electrical connectivity function at lower manufacturing cost by using established, less expensive processes
3Speed
If conventional package structures are used, then manufacturing process is straightforward, but signal transfer speed and miniaturization are limited
Solution Approach 1:
The bridge component enables three-dimensional signal routing by extending conductive pathways vertically through the package structure. This allows shorter signal paths and reduced parasitic inductance compared to lateral routing on planar substrates, thereby improving signal transfer speed while enabling package miniaturization through vertical integration rather than lateral expansion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high interconnect density without the expense of conventional methods, offering flexibility in design and reducing manufacturing complexity, thereby enabling cost-effective and efficient microelectronic package development.
Implementation Method 1
the bridge component is coupled to the substrate using an adhesive
Data Source
AI summary
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.