Broadside Antenna Single PCB Substrate Mutual Coupling
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Solution Overview
Problem
Conventional millimeter-wave antenna arrays operating in W-band (70-100 GHz) face challenges with strong mutual coupling between elements and complex, costly fabrication processes due to the use of multiple substrates and hybrid integration methods.
Innovation Solution
The use of a single printed circuit board (PCB) substrate with a truncated microstrip ground plane and quarter-wave reflector enables integration of broadside low-profile microstrip antennas, reducing mutual coupling and simplifying fabrication by eliminating the need for RF signal vias and allowing for broadband input impedance matching and low-profile broadside radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of moving object
If conventional aperture coupled patch antennas are used, then broadband operation is achieved, but mutual coupling between neighboring elements increases
Solution Approach 1:
The patent introduces an aperture in the ground plane as an intermediary coupling mechanism between the microstrip feedline and the radiating patch. This aperture-coupled configuration acts as a mediator that reduces direct electromagnetic coupling between adjacent feedlines and radiating elements, thereby lowering mutual coupling while maintaining broadband operation through resonant coupling effects
2Reliability
If multiple substrates and hybrid integration methods are used, then antenna performance is improved, but fabrication complexity and cost increase
Solution Approach 1:
The patent combines the radiating patch, ground plane, and feedline structures into a single integrated PCB substrate configuration. The microstrip feedline, aperture-coupled ground plane, and radiating elements are all fabricated on one substrate using standard PCB techniques, eliminating the need for multiple substrate assemblies and hybrid integration methods while maintaining antenna performance
3Speed
If conventional microwave substrates are used, then antenna operation at millimeter-wave frequencies is achieved, but integration with control circuits becomes difficult
Solution Approach 1:
The patent designs the PCB substrate to serve multiple functions simultaneously: it acts as the antenna radiating structure, the ground plane, the feedline transmission medium, and the integration platform for control circuits and surface mount components. This multi-functional substrate enables both millimeter-wave antenna operation and easy integration of electronic circuits on the same platform
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves mutual coupling below -15 dB and input return loss greater than 10 dB over a 20 GHz band, facilitating the integration of antennas with control circuits and surface mount components, while maintaining low profile and broadside radiation patterns.
Implementation Method 1
the antenna is configured to achieve broadband input impedance matching of a 20 GHz input return loss higher than 10 dB for a millimeter-wave operating band due to an optimization of multiple resonances in the system
Implementation Method 2
A small aperture in a ground plane couples the radiating patch to the microstrip
Data Source
AI summary
At least one example embodiment discloses an antenna system. The antenna system includes a single printed circuit board (PCB) substrate and an antenna integrated with the single PCB substrate, the antenna being a broadside low-profile microstrip antenna.