Bubble Ejection Member for Localized Plating
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Solution Overview
Problem
Conventional plating methods, such as electroplating and non-electrolytic plating, face limitations in plating nonconductive materials like silicon, rubber, or resin, requiring complex pretreatments and excessive use of plating solutions, while vapor plating is costly and requires large facilities.
Innovation Solution
A plating method using a bubble ejection member with a conductive electrode and insulating material to eject bubbles into a plating solution, converting metal ions or nanoparticles into a metal layer on various targets without pretreatment, allowing for precise placement and reduced solution usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electroplating or non-electrolytic plating is used to plate nonconductive materials, then plating can be achieved, but complex substrate surface treatment is required in advance
Solution Approach 1:
The patent applies preliminary action by forming a catalyst layer in advance on the substrate surface at the intended plating position before performing non-electrolytic plating. This preliminary catalyst formation enables subsequent plating on nonconductive materials without requiring complex surface treatments during the main plating process
Solution Approach 2:
The patent uses a catalyst layer as an intermediary substance that mediates between the nonconductive substrate and the plating process. The catalyst layer is formed in advance on the substrate surface, enabling the plating process to proceed without directly treating the nonconductive substrate surface
2Adaptability or versatility
If vapor plating is used to plate a target, then plating can be achieved, but facility size and cost increase
Solution Approach 1:
The patent extracts the plating process from a large-scale vapor plating facility environment and implements it in a simplified, localized manner using non-electrolytic plating with catalyst layers, thereby achieving plating capability without requiring large facility volume
Solution Approach 2:
The patent employs a simplified, cost-effective plating approach using non-electrolytic plating with catalyst layers instead of expensive vapor plating equipment, achieving plating capability with minimal facility investment
3Adaptability or versatility
If electroplating or non-electrolytic plating is used, then plating can be achieved, but large amount of plating solution is consumed
Solution Approach 1:
The patent applies local quality by forming catalyst layers only at the intended plating positions on the substrate surface, enabling plating to occur locally at specific areas rather than requiring immersion in large amounts of plating solution, thus reducing solution consumption
4Manufacturing precision
If substrate surface treatment is performed to enable plating on specific positions, then precise plating placement is achieved, but manufacturing process becomes complex
Solution Approach 1:
The patent applies preliminary action by forming catalyst layers in advance at the intended plating positions on the substrate surface. This preliminary localization of catalysts enables precise plating placement without requiring complex surface treatment processes to be performed during the main manufacturing flow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables plating on diverse targets without pretreatment, reducing solution consumption and facilitating precise metal placement, thus simplifying the manufacturing process and improving efficiency.
Implementation Method 1
ejecting bubbles generated by the bubble ejection member to a plating solution, wherein the bubble ejection member includes an electrode formed of a conductive material
Implementation Method 2
an electrode formed of a conductive material
Data Source
AI summary
A method that can plate a predetermined position on various plating targets without implementing a pretreatment thereon is provided. A plating method is performed on a plating target using a plating solution, and the plating method includes at least a bubble ejection step of ejecting a bubble generated by a bubble ejection member to a plating solution. The bubble ejection member includes an electrode formed of a conductive material and an insulating material covering at least a part of the electrode, at least a part of the insulating material forms a bubble ejection port, and an air gap surrounded by the insulating material is formed between at least a part of the electrode and the bubble ejection port.