Buffer Layer for Stress Management in Display Cover Drilling
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Solution Overview
Problem
Current display devices with high screen-to-body ratios face yield decreases due to stress-induced cracks in glass glue when holes are drilled, caused by the brittleness of ceramic materials used in glass glue.
Innovation Solution
A glass cover with a buffer layer, comprising polymer or photosensitive glue materials, is introduced to absorb stress during hole drilling, which is disposed on the glass cover corresponding to the boring area, and can completely or partially cover the area to effectively buffer the stress generated in the encapsulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If glass glue is used for encapsulation to achieve high screen-to-body ratio, then packaging and sealing are improved, but stress-induced cracks occur during hole drilling reducing yield
Solution Approach 1:
A buffer layer is applied on the glass cover at the boring area before hole drilling occurs. This buffer layer absorbs the stress generated during drilling, preventing stress-induced cracks in the glass glue encapsulation layer, thereby maintaining both reliability and productivity
2Reliability
If glass glue is used for encapsulation, then sealing is improved, but brittleness causes stress concentration during drilling
Solution Approach 1:
The encapsulation structure combines glass glue (providing sealing) with a buffer layer material (providing stress resistance). This composite structure allows the glass glue to maintain its sealing function while the buffer layer compensates for its brittleness by absorbing drilling stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer layer reduces stress on the encapsulation layer during hole drilling, thereby improving the yield of display devices by preventing cracks and enhancing the durability of the glass cover.
Implementation Method 1
the buffer layer is configured to buffer stress generated in the encapsulation layer when a hole is drilled in the boring area
Data Source
AI summary
A cover, a display panel, and a cover manufacturing method are provided. The cover includes a glass cover, and the glass cover includes a boring area. An encapsulation layer is disposed on a side of the glass cover, and a buffer layer is disposed on the side of the glass cover away from the encapsulation layer. The buffer layer is disposed on the glass cover corresponding to the boring area, and the buffer layer is configured to buffer stress generated in the encapsulation layer when a hole is drilled in the boring area.