Electrical Equipment TRIZ Cases

A supporting glass substrate with a surface compression stress layer manages thermal expansion variation during semiconductor packaging heating.

Capacitive coupling between segmented coating and connectors resolves the trade-off between touch sensitivity and electrical connection reliability.

A thermal-curable resin composition combines bismaleimide, cyanate ester, and epoxy resins to achieve low viscosity.

HNBR hose with reinforcing fibers prevents dielectric fluid migration, avoiding electronic damage while reducing weight and cost.

Polymaleimide and modified polyphenylene ether resin composition enhances peel strength for printed circuit boards.

A glass article uses a central lithium disilicate layer and a surface lithium alumino silicate layer to generate compressive stress for improved strength.

A modified cycloolefin copolymer resin composition cross-linked with unsaturated resins to form thermosetting laminates.

Integrated auxiliary layers and side-reinforcing members enclose cut surfaces, eliminating stepped shapes that reduce durability.

A noise suppression sheet uses a non-magnetic metal layer between magnetic layers to absorb electromagnetic noise.

Long-chain aliphatic maleimide resins paired with dual DOPO flame retardants resolve thermal resistance trade-offs while improving dielectric properties.

A laminated glass structure uses a low-plasticizer polyvinyl acetal coating to enhance penetration resistance and heat-shielding capabilities.

Dicyclopentadiene-norbornene copolymer prepolymer reduces coefficient of thermal expansion while maintaining low dissipation factor for high-speed laminates.

Merging protective functions into a single laminated glass assembly improves weather resistance while reducing costs.

A dicyclopentenyl group-containing epoxy resin composition formed by epoxidizing a Lewis acid-catalyzed phenol resin.

Non-polar hydrophobic groups in the diamine backbone improve toughness and processability while maintaining a low dielectric constant below 2.6.

Reducing FRP precursor waviness to 12 µm suppresses light spots on thin copper foils while enabling single-stage lamination.

A polymer buffer layer absorbs mechanical stress during hole drilling, preventing cracks in the encapsulation layer and improving manufacturing yield.

A curved window integrates a stainless steel film with a polymer resin layer to maintain shape and protect the display panel from external impacts.

A calcined mica laminate structure with aramid floc binding achieves high dielectric strength.

A photovoltaic module package uses low-sodium glass and a fused glass frit seal to protect silicon wafers from environmental damage.

Selective chemical strengthening creates compressive stress layers on specific cover glass surfaces using a heated potassium bath.

A bendable backplane structure uses memory metal doped in flexible layers to enable bidirectional bending of an OLED display assembly.

Fused ring maleimide resin lowers transmission loss while maintaining conductor adhesion in high-frequency circuits.

A halogen-free resin composition combines polyphenylene ether and allyl cyclophosphazene to achieve low dielectric constants.

Continuous laser welds join three stacked aluminum sheets to eliminate gasket blowout risks and reduce weight in electric vehicle battery packs.

A releasable resin layer composite combines nonpolar and thermosetting resins to enable low-strength separation from metal foil substrates.

A resin composition combines vinyl-containing polyphenylene ether with polyolefin terpolymers to achieve uniform glass transition temperatures.

Embedding a rigid core with varying elastic moduli inside an elastic component improves rebound force and reduces warping during rolling processes.

Matching refractive indices of silane-treated glass fibers and epoxy resin reduces light diffusion while maintaining structural capacity.

Intersecting thin metal wire patterns with a defined intersection area enhance the signal-to-noise ratio, improving touch position detection accuracy.

Combining aliphatic and aromatic polyisocyanates resolves the contradiction between room temperature storage stability and high glass transition temperatures.

An extending portion supporter uses overlapping metal thin film layers to support a second display region without increasing the supporting unit volume.

Interwoven adhesion polymer chains resolve poor bonding between dissimilar materials, enabling stable strain sensing under large deformation.

Adjusting Al2O3 and B2O3 ratios against modifiers enables laminated glass substrates with high Young's modulus and precise CTE control.

Stacked metallic layers form complex internal cavities while avoiding drilling depth limits, requiring residue removal to maintain surface quality.

A coated sheet metal strip separates the reaction accelerator from the adhesive using a dedicated carrier layer to prevent premature chemical interaction.

A resin composition limits outgas emission during thermal analysis to minimize diameter differences between through and non-through holes.

An alkali metal-doped polyimide laminate withstands 550°C processing without warpage, eliminating barrier films and improving crystal growth.

A polyphenylene ether resin composition uses two initiators with specific half-life temperatures to enhance storage stability and reduce pressing time.

A laser-assisted glass frit bonding method forms hermetic seals between glass sheets.

Phenol-based resin with aliphatic hydrocarbon groups delivers adhesion strength to metal foils while maintaining crack resistance under severe environments.

Silane-modified bismaleimide resin reacts with organic silicone and hydrocarbon resins to resolve dielectric property and homogenization contradictions.

A vinyl group-containing polyphenylene ether resin composition enhances copper foil peeling strength and reduces water absorption in printed circuit boards.

Segmented cover glass resolves visibility and strength trade-offs by isolating display regions via shielding layers.

A resin composition combines polyphenylene ether with reactive diluents to form a crosslinked network.

A polyvinyl acetal encapsulant with controlled storage elastic modulus and compression shear strength enables frameless solar cell implementation.

A fluorene-containing epoxy resin composition enhances optical reflectance in ultraviolet and visible light regions.

Multi-layer conductive coating on transparent panes minimizes unwanted reflections and double images while maintaining structural stability.

Intersecting asymmetric slits in a package mask compensate for directional ink permeation, eliminating Newton rings from inconsistent adhesive heights.