Releasable Resin Layer Composite for Low-Strength Metal Foil Release
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Solution Overview
Problem
The existing methods for manufacturing multilayer printed wiring boards face challenges in reducing the thickness and weight of insulating interlayers and the wiring board itself, with issues related to high release strength and damage of releasable resin layers during the manufacturing process, particularly during hot pressing, which affects the adhesion and positional stability.
Innovation Solution
A metal foil-releasable resin layer composite is developed, comprising a metal foil with a releasable resin layer composed of 50 to 95 parts nonpolar resin, 4 to 40 parts thermosetting resin, and 1 to 25 parts release agent, optimized to achieve low release strength and withstand hot pressing without damage, using a specific mass ratio of nonpolar to thermosetting resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a releasable resin layer containing thermosetting resin is used to withstand hot pressing, then heat resistance is improved, but release strength becomes too high and the resin layer becomes brittle and easy to break
Solution Approach 1:
The patent uses a composite resin layer containing both thermosetting resin (for heat resistance) and nonpolar resin (for low release strength and flexibility). This combination allows the resin layer to withstand hot pressing temperatures while maintaining desirable release characteristics and preventing breakage during separation.
Solution Approach 2:
The patent modifies the chemical composition parameters of the resin layer by incorporating nonpolar resin components with specific molecular structures that reduce adhesion to the metal foil. This changes the release strength parameter while maintaining the thermosetting resin's heat resistance properties.
2Strength
If prepreg is used as the reinforcing substrate, then supporting ability is improved, but cost increases and surface waviness affects the build-up wiring layer
Solution Approach 1:
The patent replaces expensive prepreg substrates with a cost-effective resin layer that can be applied directly to the metal foil. The resin layer provides sufficient supporting ability during the manufacturing process without the high cost associated with prepreg materials.
Solution Approach 2:
The patent extracts the essential supporting function from the expensive prepreg substrate and implements it through a simpler, cheaper resin layer system. This removes the unnecessary cost and surface waviness issues while retaining the required structural support.
3Weight of stationary object
If the resin layer is made thin to reduce weight and thickness, then packaging density is improved, but the resin layer becomes more susceptible to damage during release
Solution Approach 1:
The patent creates a thin yet durable resin layer by combining thermosetting resin (providing strength and damage resistance) with nonpolar resin (providing flexibility and low release strength). This composite structure allows the layer to be thin enough for weight reduction while remaining resistant to damage during the release process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite allows for efficient release of the metal foil from the resin layer with significantly low release strength, preventing damage and ensuring adhesion, thus improving manufacturing efficiency and reducing material costs by eliminating the need for expensive prepreg substrates.
Implementation Method 1
a releasable resin layer on at least one surface of the metal foil. The releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin
Data Source
AI summary
There is provided with a metal foil-releasable resin layer composite comprising a metal foil and a releasable resin layer on at least one surface of the metal foil, wherein the releasable resin layer includes 100 parts by mass, in total, of (A) 50 to 95 parts by mass of a nonpolar resin, (B) 4 to 40 parts by mass of a thermosetting resin, and (C) 1 to 25 parts by mass of a release agent, wherein the mass ratio (A/B) of the nonpolar resin (A) to the thermosetting resin (B) is 55/45 to 96/4. The metal foil-releasable resin layer composite can achieve release with significantly low release strength between the metal foil and the releasable resin layer without damage of the releasable resin layer and can withstand hot pressing.