Thermal-Curable Resin Composition for Low Viscosity and High Dimensional Stability
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Solution Overview
Problem
Conventional thermal-curable resin compositions with high filler loading face issues of increased viscosity, which hinders wetting and encapsulation of wiring in multi-layer boards, leading to voids and delamination, while existing solutions either increase costs or compromise dielectric properties.
Innovation Solution
A thermal-curable resin composition combining bismaleimide resin, cyanate ester resin, and a small amount of epoxy resin with a high filler content, optimized to maintain low viscosity and improve dielectric properties and heat resistance, using specific ratios and additives like benzoxazine resin and phosphorus-containing flame retardants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a large amount of filler is added to the resin composition to reduce CTE and improve dimensional stability, then the dimensional stability is improved, but the viscosity increases substantially causing deterioration of wetting factor and difficulty in encapsulation
Solution Approach 1:
The patent uses a composite resin system combining bismaleimide resin, cyanate ester resin, and epoxy resin in specific ratios. This composite approach allows the material to achieve both high filler loading (40-60 wt%) for dimensional stability and controlled viscosity for manufacturability, as each resin component contributes different properties that complement each other
Solution Approach 2:
The patent optimizes the ratio parameters of the resin components (bismaleimide: cyanate ester: epoxy = 1:0.5-2.0:0.1-1.0) to achieve the desired balance between viscosity and dimensional stability. By adjusting these compositional parameters, the resin can accommodate high filler content while maintaining processability
2Stability of the object's composition
If a large amount of filler is added to reduce CTE, then the dimensional stability is improved, but the wetting factor deteriorates leading to voids and delamination
Solution Approach 1:
The multi-resin composite system enhances wetting capability while supporting high filler loading. The epoxy resin component provides excellent adhesion and wetting properties, while the bismaleimide and cyanate ester resins contribute to dimensional stability, creating a synergistic effect that maintains both reliability and stability
Solution Approach 2:
The resin composition is designed to have different functional components distributed throughout the system, with each resin type contributing specific local properties: epoxy for wetting and adhesion at interfaces, and bismaleimide/cyanate ester for dimensional stability in the bulk material
3Ease of manufacture
If spherical powder filler is added to resolve high viscosity, then the viscosity is lowered, but the cost increases substantially
Solution Approach 1:
The patent controls viscosity by adjusting the compositional parameters of the resin system and filler loading rather than adding expensive spherical fillers. The optimized resin ratio and filler content (40-60 wt%) achieve acceptable viscosity levels through formulation design
Solution Approach 2:
The patent uses conventional, cost-effective filler materials (such as glass beads, metal particles, or ceramic fillers) instead of expensive spherical fillers. The resin composition is formulated to work effectively with these standard materials, reducing overall cost while maintaining processability
4Ease of operation
If viscosity modifier is added to improve operability, then the operability is improved, but the dielectric properties are adversely affected
Solution Approach 1:
The patent achieves improved operability by changing the parameters of the resin composition itself (ratios of bismaleimide, cyanate ester, and epoxy resins) rather than adding viscosity modifiers. This approach maintains dielectric properties while achieving acceptable viscosity and flow characteristics during manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves low viscosity, excellent dielectric properties, and high dimensional stability, enabling reliable production of multi-layer boards and IC substrates with improved heat resistance and reduced voids and delamination.
Implementation Method 1
thermal-curable resin composition which comprises a combination of a bismaleimide resin, a cyanate ester resin, a small amount of epoxy resin and a relatively large amount of filler in a certain ratio
Data Source
AI summary
A thermal-curable resin composition is provided. The thermal-curable resin composition comprises:(A) a thermal-curable resin component, which comprises:(a1) bismaleimide resin;(a2) cyanate ester resin; and(a3) epoxy resin,wherein the cyanate ester resin (a2) and the epoxy resin (a3) are respectively in an amount ranging from 50 parts by weight to 150 parts by weight and from 24 parts by weight to 51 parts by weight per 100 parts by weight of the bismaleimide resin (a1); and(B) a filler,wherein the filler (B) is in an amount ranging from 40 parts by weight to 55 parts by weight per 100 parts by weight of the dry weight of the resin composition; andwherein the resin composition has a dynamic viscosity of not higher than 800 Pa·s after being brought into a semi-cured state (B-stage), and the resin composition has a dissipation factor (Df) of not higher than 0.006 at 10 GHz after being cured completely.