Modified Bismaleimide Prepolymer for High-Frequency Substrates
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Solution Overview
Problem
Bismaleimide resins exhibit poor dielectric properties, limiting their application in high-frequency and high-speed package substrates, and existing modifications, such as introducing polyphenylene oxide or reactive organic silicone resin, do not adequately address these issues due to compatibility and homogenization challenges.
Innovation Solution
A modified bismaleimide prepolymer is developed by introducing silicon-oxygen bonds and carbon-hydrogen bonds through a reaction with a double bond-containing organic silicone resin and a hydrocarbon resin, controlling the weight ratio to improve polymerization processability, toughness, and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene oxide resin is introduced into bismaleimide resin to reduce dielectric properties, then dielectric properties are improved to some extent, but compatibility is poor and homogenization is difficult
Solution Approach 1:
The patent uses a silane-modified bismaleimide compound as an intermediary that bridges the compatibility gap between thermosetting bismaleimide resin and thermoplastic polyphenylene oxide resin. The silane modification introduces functional groups that enhance interfacial adhesion and compatibility, allowing the two previously incompatible resins to form a well-homogenized colloid-liquid complex without phase separation.
Solution Approach 2:
The patent modifies the chemical parameters of the bismaleimide resin by introducing silane functional groups, which change the resin's polarity, reactivity, and compatibility characteristics. This parameter change enables better mixing and homogenization with polyphenylene oxide resin while maintaining the desired dielectric properties.
2Strength
If bismaleimide resin is used to achieve high heat resistance and high modulus, then mechanical properties are improved, but dielectric properties deteriorate
Solution Approach 1:
The patent creates a composite resin system combining silane-modified bismaleimide resin with polyphenylene oxide resin. This composite material integrates the high heat resistance and modulus of bismaleimide with the low dielectric properties of polyphenylene oxide, achieving a balanced performance that satisfies both mechanical and electrical requirements for high-frequency and high-speed package substrates.
3Temperature
If reactive organic silicone resin is introduced to improve heat resistance and reduce CTE, then thermal properties are improved, but dielectric properties remain insufficient
Solution Approach 1:
The patent performs dual modification of the bismaleimide resin - first with silane groups to improve compatibility and dielectric properties, and then with polyphenylene oxide to further optimize the dielectric constant and loss tangent. This sequential parameter modification achieves superior dielectric performance while maintaining the heat resistance improvements from silicone resin incorporation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified bismaleimide prepolymer achieves improved dielectric properties, reduced brittleness, and maintained high heat resistance and low coefficient of thermal expansion, making it suitable for high-frequency and high-speed package substrates.
Implementation Method 1
a modified bismaleimide prepolymer, which is prepared by a reaction of a bismaleimide compound, a double bond-containing organic silicone resin and a hydrocarbon resin
Data Source
AI summary
The invention provides a modified bismaleimide prepolymer, prepared by a reaction of a bismaleimide compound, a double bond-containing organic silicone resin and a hydrocarbon resin. A mass ratio of the bismaleimide compound to the double bond-containing organic silicone resin to the hydrocarbon resin is 100:(3-40):(5-50). According to the invention, a silicon-oxygen bond and a carbon-hydrogen bond are introduced into the bismaleimide compound, and the mass ratio of the bismaleimide compound to the double bond-containing organic silicone resin to the hydrocarbon resin is controlled, thereby improving the polymerization processability and the toughness and dielectric properties of the bismaleimide compound curing system.