Supporting Glass Substrate Thermal Expansion Control
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Solution Overview
Problem
The existing supporting glass substrates used in semiconductor packaging, particularly in FOWLP and FOPLP, face issues with damage and warping due to non-uniform temperature distributions during heating, leading to potential breakage into numerous fragments, which complicates semiconductor manufacturing processes.
Innovation Solution
A supporting glass substrate with a compression stress layer on its surface, having an average thermal expansion coefficient of 7 ppm/°C to 15 ppm/°C, internal tensile stress of 5 MPa to 55 MPa, and a compression stress layer depth of 10 μm to 60 μm, is developed. This substrate is integrated with a resin layer to form a laminated body, enhancing its thermal management and fracture resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the thermal expansion coefficient of the supporting glass substrate is set high to match the member, then separation from the member is suppressed, but the substrate becomes more prone to warping and damage due to large thermal expansion differences at different positions
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thermal expansion coefficient within 7-15 ppm/°C and the depth of the compression stress layer within 10-60 μm to achieve optimal balance between separation resistance and damage resistance
Solution Approach 2:
The patent applies local quality by creating a compression stress layer at a specific depth (10-60 μm) from the surface, where the stress distribution is optimized to counteract thermal expansion effects locally while maintaining overall substrate integrity
2Stability of the object's composition
If the supporting glass substrate is thick to reduce warping, then structural stability is improved, but the temperature difference between heated surface and center increases, leading to greater thermal expansion variation
Solution Approach 1:
The patent changes the stress distribution parameter by introducing a compression stress layer at a controlled depth, which compensates for thermal expansion differences caused by temperature gradients in thick substrates
Solution Approach 2:
The compression stress layer is formed in advance through chemical strengthening treatment before the substrate undergoes thermal processing, preparing the substrate to resist warping when temperature differences occur during heating
3Reliability
If the supporting glass substrate breaks, then it generates many fragmental pieces that scatter, but preventing and removing these fragments takes a long time, greatly affecting productivity
Solution Approach 1:
The compression stress layer acts as a preventive measure formed in advance that cushions against the propagation of cracks, reducing the likelihood of catastrophic failure and the number of fragments generated when breaking occurs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces damage and the risk of breaking into numerous fragments, thereby improving the productivity and reliability of semiconductor manufacturing processes by maintaining the structural integrity of the supporting glass substrate under varying thermal conditions.
Implementation Method 1
a compression stress layer on a surface of the supporting glass substrate, the supporting glass substrate having an average thermal expansion coefficient at 50° C. to 200° C. that is 7 ppm/° C. to 15 ppm/° C., an internal tensile stress that is 5 MPa to 55 MPa, and a depth of the compression stress layer that is 10 μm to 60 μm
Implementation Method 2
the thermal expansion coefficient of the supporting glass substrate is also set to be high accordingly... due to the difference in the temperature distribution, it is concerned that the supporting glass substrate may be warped and damaged since the thermal expansion amount varies at each position
Data Source
AI summary
A supporting glass substrate includes a compression stress layer on a surface thereof, and has an average thermal expansion coefficient at 50° C. to 200° C. that is 7 ppm/° C. to 15 ppm/° C., an internal tensile stress that is 5 MPa to 55 MPa, and a depth of the compression stress layer that is 10 μm to 60 μm.