Resin Composition for High-Frequency PCB Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Substrate materials for printed wiring boards face challenges in achieving both excellent dielectric characteristics and adhesion to conductors, particularly in high-frequency bands above 10 GHz, where existing resin compositions fall short in providing both low dielectric loss tangent and high adhesion.
Innovation Solution
A resin composition incorporating a maleimide compound with a fused ring structure, such as an indane ring, and a resin with a tensile elastic modulus of 10 GPa or less, combined with a polyolefin-based resin, a polyphenylene ether-based resin, or an epoxy resin, to enhance dielectric characteristics and conductor adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the contact area between insulating layer and conductor is decreased to reduce transmission loss, then dielectric characteristics are improved, but adhesion between insulating layer and conductor is reduced
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating specific maleimide compounds with fused ring structures and controlling the elastic modulus of the resin to below 10 GPa at 25°C. This parameter optimization allows the resin to achieve both low dielectric loss tangent (improving transmission loss) and high adhesion strength to conductors simultaneously
Solution Approach 2:
The patent creates a composite resin system combining maleimide compounds with fused ring structures (such as indane rings) and elastomers with specific elastic modulus characteristics. This composite material approach enables the resin to exhibit both excellent dielectric properties for high-frequency signals and enhanced adhesion to metal conductors through the synergistic effects of the different components
2Reliability
If dielectric characteristics are improved for high-frequency signals, then transmission loss is reduced, but adhesion to conductors deteriorates
Solution Approach 1:
The patent optimizes the resin composition parameters by incorporating maleimide compounds with fused ring structures and controlling the elastic modulus to 10 GPa or less at 25°C. This parameter optimization enables the resin to achieve low dielectric loss tangent for excellent high-frequency characteristics while simultaneously providing high adhesion strength to conductors
Solution Approach 2:
The resin acts as an intermediary material between the metal conductors and the insulating layer. By carefully selecting the resin composition (maleimide compounds with fused ring structures and low elastic modulus elastomers), the patent creates an intermediate layer that maintains strong bonding to conductors while providing excellent dielectric properties for high-frequency signal transmission
Data Source
AI summary
The present invention relates to a resin composition containing (A) at least one selected from the group consisting of a maleimide compound including a fused ring of an aromatic ring and an aliphatic ring in the molecular structure thereof, and having two or more N-substituted maleimide groups, and its derivative, and (B) a resin having a tensile elastic modulus of 10 GPa or less at 25° C., and a prepreg, a laminated plate, a resin film, a printed wiring board, and a semiconductor package which use the resin composition.