Resin Composition for Printed Circuit Boards with DOPO Flame Retardant
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Solution Overview
Problem
Conventional resin compositions for printed circuit boards face challenges in achieving desirable laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, and dielectric properties, particularly with the use of maleimide, which results in poor thermal resistance and environmental concerns due to halogen-free flame retardants.
Innovation Solution
A resin composition comprising a flame retardant with at least two DOPO groups and an aliphatic long-chain maleimide compound, along with optional additives like vinyl compounds, epoxy resins, and cyanate ester resins, to enhance properties such as formability, reliability, chemical resistance, and thermal stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If maleimide is used as the main resin component, then flame retardancy is improved, but thermal resistance deteriorates
Solution Approach 1:
The patent changes the chemical structure parameters of the maleimide resin by introducing long-chain aliphatic groups (C10-C50) instead of conventional aromatic or short-chain structures. This structural modification allows the resin to maintain flame retardancy while improving thermal resistance, as the long aliphatic chains provide better thermal stability without compromising the flame-retardant properties of the maleimide group.
Solution Approach 2:
The patent creates a composite resin system by combining long-chain aliphatic maleimide compounds with specific flame retardant additives (such as aluminum hydroxide, magnesium hydroxide, or boron nitride). This composite approach enables the material to simultaneously achieve excellent flame retardancy and thermal resistance, overcoming the limitation of using maleimide alone.
2Object-generated harmful factors
If halogen-free flame retardants are used, then environmental pollution is reduced, but thermal resistance deteriorates
Solution Approach 1:
The patent modifies the resin base structure to have higher inherent thermal stability through long-chain aliphatic maleimide compounds, which compensates for the lower thermal resistance of halogen-free flame retardants. The enhanced thermal stability of the resin matrix allows halogen-free additives to function effectively without compromising overall thermal performance.
Solution Approach 2:
The patent develops a composite formulation combining halogen-free flame retardants with long-chain aliphatic maleimide resin and potentially other synergistic additives. This composite material achieves both environmental friendliness and adequate thermal resistance through the synergistic effect of its components, where the resin matrix provides thermal stability while the halogen-free additives provide flame retardancy without pollution.
3Object-affected harmful factors
If conventional maleimide resin is used, then flame retardancy is improved, but laminate formability deteriorates
Solution Approach 1:
The patent changes the molecular structure parameters of the maleimide resin by incorporating long flexible aliphatic chains, which improve the resin's processability and laminate formability. The increased chain length and flexibility enhance the resin's ability to flow and conform during lamination while maintaining the flame-retardant characteristics of the maleimide functional group.
4Ease of manufacture
If conventional materials are used, then manufacturing simplicity is maintained, but reliability of multiple laminations deteriorates
Solution Approach 1:
The patent develops a composite resin system that combines long-chain aliphatic maleimide compounds with coupling agents and potentially other functional additives. This composite formulation enhances interlayer bonding strength and adhesion to reinforcement materials, ensuring reliable multiple lamination while maintaining relatively simple manufacturing processes compatible with conventional PCB production lines.
Data Source
AI summary
Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.