Modified Cycloolefin Copolymer Resin for High-Frequency PCBs
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Solution Overview
Problem
Conventional materials used in printed circuit boards, such as polyphenylene ether and polyolefin resins, face challenges with high dielectric dissipation factors and thermal-oxidative aging issues at high frequencies, while cycloolefin copolymers offer excellent dielectric properties but poor peel strength, making them unsuitable for direct use in copper clad laminates.
Innovation Solution
A thermosetting resin composition is developed using a modified cycloolefin copolymer with methacrylate end groups, which is cross-linked with other unsaturated resins to enhance bonding performance and maintain excellent dielectric properties, resulting in a laminate with improved peel strength and heat resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If polyphenylene ether resin is used as low dielectric material, then dielectric constant is reduced, but dielectric dissipation factor cannot be controlled low enough and material becomes fragile
Solution Approach 1:
The patent uses a composite resin system combining polyphenylene ether (PPE) with polybutadiene (PB) and cycloolefin copolymer (COC). This composite approach leverages PPE's low dielectric constant, PB's flexibility and low dielectric dissipation, and COC's thermal stability, achieving both low dielectric constant and controlled dielectric dissipation factor while improving mechanical properties.
2Ease of manufacture
If polyolefin resin is used, then processing is improved, but thermal-oxidative aging problem occurs due to insufficient curing
Solution Approach 1:
The patent modifies the polyolefin resin by incorporating polybutadiene with specific molecular weight (100,000-300,000) and controlled unsaturation (0.5-5 mmol/g), along with PPE and COC copolymer. This parameter optimization enables sufficient curing through the unsaturated bonds while maintaining processing properties and preventing thermal-oxidative aging.
3Reliability
If cycloolefin copolymer is used, then dielectric properties and heat resistance are improved, but peel strength becomes poor
Solution Approach 1:
The patent merges cycloolefin copolymer (COC) with polyphenylene ether (PPE) and polybutadiene (PB) in a specific composition ratio. The COC provides excellent dielectric properties and heat resistance, while PPE contributes to adhesion and PB provides flexibility. This merging of materials achieves both high dielectric performance and adequate peel strength through synergistic effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified cycloolefin copolymer-based thermosetting resin composition achieves low dielectric constants, low dielectric dissipation factors, and high glass transition temperatures, suitable for high-frequency communication applications, with enhanced peel strength and thermal stability.
Implementation Method 1
a modified cycloolefin copolymer having a structure as shown in formula I, and other unsaturated resins
Implementation Method 2
thermosetting resin composition includes a resin component, in which the resin component includes a modified cycloolefin copolymer
Implementation Method 3
achieves low dielectric constants, low dielectric dissipation factors, and high glass transition temperatures
Implementation Method 4
high glass transition temperatures, suitable for high-frequency communication applications
Data Source
AI summary
Provided are a thermosetting resin composition and a prepreg, laminate and printed circuit board using same. The thermosetting resin composition comprises a resin component, the resin component comprising a modified cyclic olefin copolymer having a structure as shown in formula I and another unsaturated resin. By introducing a methacrylate end group having a certain polarity into a cyclic olefin copolymer, a modified cyclic olefin copolymer is formed. The modified cyclic olefin copolymer can form a thermosetting material by means of cross-linking with itself or another unsaturated resin, whereby the bonding property can be significantly improved while retaining the excellent dielectric properties of the cyclic olefin copolymer itself. The laminate prepared using the thermosetting resin composition has good dielectric properties, a good peel strength and a good heat resistance, and can meet all the performance requirements for printed circuit board substrates in the current high-frequency and high-speed communication field.