Resin Composition for Printed Circuit Boards with Peel Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing resin compositions for printed wiring boards do not simultaneously achieve excellent peel strength, low water absorption properties, desmear resistance, and flame resistance, which are crucial for advanced semiconductor packages and communication devices.
Innovation Solution
A resin composition comprising a polymaleimide compound, a modified polyphenylene ether with a carbon-carbon unsaturated double bond, and a filler, optionally including a cyanate compound and/or an epoxy resin, along with a curing accelerator, to enhance peel strength, water resistance, and flame resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin compositions are used, then manufacturing simplicity is maintained, but multiple critical characteristics (peel strength, water absorption, desmear resistance, flame resistance) cannot be simultaneously improved
Solution Approach 1:
The patent employs a composite resin system combining polymaleimide compound, modified polyphenylene ether, cyanate resin, and epoxy resin. This multi-component composite approach enables simultaneous achievement of excellent peel strength, low water absorption, desmear resistance, and flame resistance that cannot be obtained with single resin systems.
Solution Approach 2:
The patent specifies precise compositional parameters including weight ratios of each resin component, molecular weight ranges of the polymaleimide compound, and structural characteristics of the modified polyphenylene ether. By optimizing these parameters, the composition achieves multiple performance targets simultaneously.
2Reliability
If conventional resin compositions are used, then composition simplicity is maintained, but water absorption properties deteriorate
Solution Approach 1:
The combination of polymaleimide compound and modified polyphenylene ether creates a composite system with inherently low water absorption. The cyanate resin and epoxy resin components further enhance moisture resistance through their crosslinked network structures, achieving superior water absorption properties that single resins cannot provide.
3Reliability
If conventional resin compositions are used, then manufacturing simplicity is maintained, but desmear resistance deteriorates
Solution Approach 1:
The polymaleimide compound provides excellent desmear resistance through its chemical structure, while the modified polyphenylene ether and cyanate resin components contribute additional desmear protection. This composite approach ensures superior desmear resistance that meets stringent requirements for advanced printed wiring boards.
4Reliability
If conventional resin compositions are used, then composition simplicity is maintained, but flame resistance deteriorates
Solution Approach 1:
The patent incorporates flame-resistant components including polymaleimide compound and modified polyphenylene ether with inherent flame resistance characteristics. The cyanate resin and epoxy resin further contribute to flame retardancy through their crosslinked structures, achieving UL94 V-0 or V-1 rating that single resins cannot attain.
Data Source
AI summary
Provided is a resin composition comprising a polymaleimide compound (A) represented by the following general formula (1), a modified polyphenylene ether (B) having a terminal modified with a substituent containing a carbon-carbon unsaturated double bond, and a filler (C) : wherein a plurality of R each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a phenyl group; and n is an average value and represents 1 < n ≤ 5.