Vinyl Polyphenylene Ether Resin Composition for 5G Circuit Substrates
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Solution Overview
Problem
Conventional materials fail to meet the demands for high-performance circuit substrates required by the rapid development of 5G wireless systems and compact electronic devices, particularly in terms of copper foil peeling strength, water absorption rate, and dissipation factor.
Innovation Solution
A resin composition comprising 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 20 to 60 parts by weight of a divinylbenzene-styrene-ethylene terpolymer, and 5 to 15 parts by weight of a compound represented by Formula (1), which is used to create articles such as prepregs, resin films, laminates, or printed circuit boards, enhancing their performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional materials are used for circuit substrates, then manufacturing cost is controlled, but copper foil peeling strength is insufficient and water absorption rate is high
Solution Approach 1:
The patent employs a composite resin system combining vinyl group-containing polyphenylene ether resin with divinylbenzene-styrene-ethylene terpolymer and a specific compound from Formula (1). This multi-component composite approach creates synergistic effects that simultaneously improve copper foil adhesion through vinyl group crosslinking and reduce water absorption through the hydrophobic characteristics of the polymer matrix, resolving the contradiction between strength and reliability
Solution Approach 2:
The patent optimizes the weight ratios of resin components (vinyl group-containing polyphenylene ether resin: 100 parts, divinylbenzene-styrene-ethylene terpolymer: 20-60 parts, compound from Formula (1): 5-15 parts) to achieve optimal performance. By adjusting these compositional parameters within specific ranges, the material simultaneously achieves high copper foil peeling strength and low water absorption rate
2Reliability
If conventional materials are used for circuit substrates, then material selection is simple, but dissipation factor performance is insufficient for high-speed signal transmission
Solution Approach 1:
The patent uses a specialized composite resin formulation where vinyl group-containing polyphenylene ether resin provides excellent electrical properties with low dissipation factor, while the divinylbenzene-styrene-ethylene terpolymer and compound from Formula (1) enhance mechanical and adhesive properties. This composite approach achieves superior dissipation factor performance necessary for 5G high-speed signal transmission
Solution Approach 2:
The patent assigns specific functional roles to different resin components: the vinyl group-containing polyphenylene ether resin primarily provides low dissipation factor for electrical performance, while the other components focus on adhesion and structural properties. This functional differentiation allows each component to optimize its specific contribution without compromising overall performance
3Reliability
If conventional materials are used for circuit substrates, then processing is straightforward, but comprehensive performance cannot satisfy 5G and compact electronic device demands
Solution Approach 1:
The patent develops a multi-component resin composition where vinyl group-containing polyphenylene ether resin contributes to thermal stability and electrical properties, divinylbenzene-styrene-ethylene terpolymer provides adhesion and flexibility, and the compound from Formula (1) enhances crosslinking. This composite system achieves comprehensive performance required for 5G applications while maintaining manufacturability through established lamination and curing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition improves the copper foil peeling strength, reduces water absorption rate, and maintains excellent dissipation factor, resulting in a high-performance laminate that satisfies comprehensive demands for electronic devices.
Implementation Method 1
100 parts by weight of a vinyl group-containing polyphenylene ether resin
Implementation Method 2
20 parts by weight to 60 parts by weight of a divinylbenzene-styrene-ethylene terpolymer
Data Source
AI summary
A resin composition is disclosed. The resin composition includes 100 parts by weight of vinyl group-containing polyphenylene ether, 20 parts by weight to 60 parts by weight of ethylene-styrene-divinylbenzene copolymer, and 5 parts by weight to 15 parts by weight of a compound represented by the Formula (1). An article made from the composition is also disclosed, and the article includes prepreg, resin film, laminate, or printed circuit board.