Copolymer Prepolymer for Low Dissipation Factor Laminates
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Solution Overview
Problem
Conventional materials for copper-clad laminates, such as polytetrafluoroethylene and polyolefins, face issues like high processing temperatures, low adhesion to copper foils, and poor thermal resistance, which are not adequately addressed for high-speed data processing applications.
Innovation Solution
A prepolymer is developed by prepolymerizing a copolymer of dicyclopentadiene and norbornene with a vinyl-containing compound, such as bis(vinylphenyl) ethane or divinylbenzene, to improve glass transition temperature, thermal resistance, and copper foil peeling strength, while reducing the coefficient of thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If polytetrafluoroethylene is used as raw material for laminate, then dissipation factor is reduced to below 0.0020, but processing temperature must be above 300°C and adhesion to copper foils is poor
Solution Approach 1:
The invention changes the chemical composition parameters by using a copolymer of dicyclopentadiene and norbornene with specific m:n ratios (1:4 to 4:1) instead of conventional polytetrafluoroethylene. This parameter change enables the material to achieve low dissipation factor while allowing processing at lower temperatures (150-250°C) and improving copper foil adhesion through controlled crosslinking density.
Solution Approach 2:
The invention creates a composite resin system by combining the copolymer of dicyclopentadiene and norbornene with copper foils and optional inorganic fillers. This composite approach achieves ultra-low dissipation factor (Df≤0.0020) while the copolymer matrix provides both low processing temperature requirement and good adhesion to copper foils.
2Loss of energy
If polyolefins are used as raw material for laminate, then dissipation factor is reduced, but coefficient of thermal expansion increases and thermal resistance decreases
Solution Approach 1:
The invention changes the polymer composition by using copolymer of dicyclopentadiene and norbornene with controlled m:n ratios, which inherently provides lower coefficient of thermal expansion compared to polyolefins. The crosslinking degree control further stabilizes the composition, reducing thermal expansion while maintaining low dissipation factor.
3Loss of energy
If polytetrafluoroethylene is used for laminate, then dissipation factor is low, but adhesion to copper foils is poor requiring extra resin films
Solution Approach 1:
The invention changes the chemical composition to copolymer of dicyclopentadiene and norbornene, which provides inherent adhesion to copper foils without requiring extra resin films. The controlled crosslinking degree (5-50%) optimizes both adhesion strength and electrical properties, achieving copper foil peeling strength ≥3.0 lb/in while maintaining dissipation factor ≤0.0020.
4Reliability
If glass transition temperature is increased to improve thermal resistance, then thermal resistance improves but processing becomes more difficult
Solution Approach 1:
The invention changes the polymer composition to copolymer of dicyclopentadiene and norbornene with specific m:n ratios, which achieves glass transition temperature ≥150°C (improving thermal resistance) while maintaining processability. The controlled crosslinking degree ensures the material remains workable during processing (T288 thermal resistance ≥120 minutes) while achieving the desired thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting resin composition achieves a low dissipation factor, high glass transition temperature, and low coefficient of thermal expansion, enhancing dimensional stability and copper foil adhesion, thus addressing the limitations of prior materials for high-speed data processing laminates.
Implementation Method 1
a prepolymer prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction
Implementation Method 2
the glass transition temperature and T288 thermal resistance of the copolymer of dicyclopentadiene and norbornene can be greatly improved, the coefficient of thermal expansion can be reduced to improve dimensional stability of laminates
Data Source
AI summary
A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.