Buffer Patterns Viscosity for Display Substrate Bonding

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Solution Overview

Problem

Display devices, particularly organic light-emitting display devices, face challenges in durability and stable bonding between substrates, leading to potential display defects and reduced adhesiveness due to viscosity issues with buffer patterns.

Innovation Solution

Incorporating buffer patterns with a viscosity of 5000 cps to 50000 cps, made of materials like silicon, between the seal pattern and the display area, which are arranged in specific patterns and shapes to enhance adhesiveness and support the substrates, and using a manufacturing method involving partial curing by heat application to maintain stable bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If buffer patterns with low viscosity are used to allow proper application and spread, then ease of manufacture is improved, but bonding strength between substrates deteriorates

Engineering Contradiction:

Improveapplication and spread of buffer patternsVSAvoidbonding strength between substrates

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent specifies a viscosity range of 5000-50000 cps for buffer patterns, optimizing the physical parameter to balance spreadability during manufacturing with adequate bonding strength for substrate attachment, resolving the contradiction between ease of application and bonding strength

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The buffer patterns are formed using composite material compositions that achieve the targeted viscosity range, combining materials to simultaneously provide proper flow characteristics for application and sufficient adhesive properties for substrate bonding

Inventive Principle:

Principle #40Composite materials

2Strength

If buffer patterns with high viscosity are used to improve bonding strength, then strength is improved, but ease of manufacture deteriorates due to difficulty in application and spread

Engineering Contradiction:

Improvebonding strength between substratesVSAvoidapplication and spread of buffer patterns

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent establishes an upper viscosity limit of 50000 cps to ensure buffer patterns remain sufficiently fluid for proper application and spread during manufacturing, preventing excessive viscosity from compromising ease of manufacture while maintaining adequate bonding strength

Inventive Principle:

Principle #35Parameter changes

3Area of stationary object

If seal pattern is positioned close to display area to reduce device size, then area is reduced, but reliability deteriorates due to increased stress concentration

Engineering Contradiction:

Improvedevice areaVSAvoiddurability against impact stress

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

Buffer patterns serve as intermediary elements positioned between the seal pattern and display area, absorbing and distributing impact-induced stress to protect the display area while allowing the seal pattern to be positioned closer to reduce overall device area

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The buffer patterns are pre-positioned to provide cushioning protection before impact stress reaches the display area, creating a stress-absorbing barrier that enhances reliability while maintaining compact device dimensions

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

4Reliability

If buffer patterns are made extensive to improve stress distribution, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvestress distribution capabilityVSAvoidpattern complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The buffer pattern region is segmented into discrete buffer patterns rather than a continuous extensive structure, providing effective stress distribution while maintaining simpler manufacturing processes and reduced device complexity

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves the durability of display devices by reducing impact-induced stress and maintaining stable bonding between substrates, preventing infiltration and display defects, while allowing for proper application and spread of buffer patterns.

Implementation Method 1

one or more buffer patterns between the seal pattern and the display area and having a viscosity of 5000 cps to 50000 cps

Methodology Applied

Scientific EffectViscous damping: Viscous Damping

Implementation Method 2

partially curing the one or more buffer patterns by applying heat

Methodology Applied

Scientific EffectThermal curing: Heat Treatment

Data Source

PatentUS10326103B2Display device having buffer patterns

Publication Date: 2019.06.18 SAMSUNG DISPLAY CO LTD

AI summary

A display device includes a first substrate having a display area and a non-display area around the display area, a seal pattern in the non-display area and offset from the display area, and one or more buffer patterns between the seal pattern and the display area and having a viscosity of 5000 cps to 50000 cps.