Buffer Structure for Flexible Circuit Board in Narrow Display Frames
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Solution Overview
Problem
In full-screen display devices, the flexible circuit board tends to warp and easily contact the printed circuit board outer frame, leading to squeeze issues and peel-off problems due to the narrow frame design and the resulting tensile stress on the attachment and connection between the flexible circuit board and the array substrate.
Innovation Solution
A buffer structure, comprising an elastic support and a flexible conductive layer, is integrated into the circuit board protective frame with openings to provide buffering force and increase separation distance, preventing hard contact and tensile stress, and includes an adhesive tape for easy installation and electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the frame is designed to be narrow to achieve full-screen display, then the display area is improved, but the flexible circuit board easily contacts the printed circuit board outer frame causing squeeze issues and peel-off problems
Solution Approach 1:
The patent introduces a buffer structure as an intermediary element between the flexible circuit board and the printed circuit board outer frame. This buffer structure includes a first buffer portion that contacts the flexible circuit board and a second buffer portion that contacts the outer frame, thereby preventing direct contact and squeeze between these components while maintaining the narrow frame design for full-screen display.
Solution Approach 2:
The buffer structure is pre-installed in the narrow frame region before the flexible circuit board is attached to the array substrate. This beforehand cushioning provides protective spacing and prevents tensile stress from damaging the attachment connection between the flexible circuit board and the array substrate during subsequent assembly and operation.
2Device complexity
If the flexible circuit board is positioned close to the printed circuit board outer frame to maintain narrow frame, then the device compactness is improved, but hard contact and tensile stress occur causing peel-off
Solution Approach 1:
The buffer structure serves as a mediator that maintains the compact narrow frame design while preventing hard contact between the flexible circuit board and the outer frame. The buffer structure's first buffer portion provides spacing and protects the attachment connection from tensile stress, thereby preserving attachment strength without increasing device complexity.
3Reliability
If the buffer structure is added to prevent contact between flexible circuit board and outer frame, then the attachment reliability is improved, but the device complexity increases
Solution Approach 1:
The buffer structure utilizes flexible buffer portions made from flexible materials that can deform and adapt to the narrow frame space. This flexible film approach provides the necessary protective function while occupying minimal space and adding minimal structural complexity to the device.
Solution Approach 2:
The buffer structure employs composite material design where the first buffer portion and second buffer portion are made from flexible materials with appropriate mechanical properties. This composite approach ensures both protective function and structural integration without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer structure effectively prevents peel-off issues by providing a buffering force and reducing contact pressure, ensuring stable attachment and connection of the flexible circuit board to the array substrate, while also offering electromagnetic interference shielding and electrostatic transmission.
Implementation Method 1
the buffer structure is an adhesive tape attached to a surface of the circuit board protective frame facing away from the flexible circuit board
Implementation Method 2
the buffer structure includes: an elastic support, and a flexible conductive layer on the elastic support
Data Source
AI summary
A display device is provided, including: a display panel; a backlight module; a circuit board, arranged on a side of the backlight module facing away from the display panel; a flexible circuit board, connected to the circuit board and the display panel, where the flexible circuit board includes a bending portion arranged on a side of the backlight module and extending from the display panel to the circuit board; a circuit board protective frame, arranged around the circuit board and the flexible circuit board, where an opening is provided on a first portion of the circuit board protective frame, and the first portion is a portion of the circuit board protective frame facing the bending portion; and a buffer structure, fixed on the circuit board protective frame, arranged parallel to the circuit board protective frame, and covering the opening.