Flexible Printed Circuits TRIZ Cases

Surface-mounted signal boosting circuitry on a flexible substrate compensates for attenuation over extended distances.

A flexible circuit board uses a transmissive area to expose conductive terminals for visual alignment.

Segmenting the touch window into rigid and flexible areas allows large screens to fold for portability without sacrificing display integrity.

A touch sensor pad employs a composite metal layer and conductive bonding member to join flexible circuit pads, reducing electrical resistance.

A flexible printed circuit unit integrates drive chips and connectors to enable compact display assembly.

Replacing rigid metallic inserts with a flexible capacitive sensor eliminates operator safety risks while maintaining measurement precision.

Strategic pad overlaps enable photopolymerization of a gap-fill layer, resolving bonding reliability issues in display apparatuses.

Rear bezel attachment on an opaque liner extension maintains a thin OLED profile while securing the panel and preventing thermal buckling.

An intermediary PET film allows precise electrical control of transparent electrodes while maintaining a thin profile for curved glass applications.

Printing expanding plastisol puff ink directly on flexible substrates eliminates memory folds and adhesive steps.

Printed electronics replace bulky hardware to resolve portability and reliability contradictions in medical bag heating.

A flexible device uses sliding conductive patterns embedded in a dielectric layer to maintain electrical connectivity during bending.

An indent pattern in the support film reduces bending stress concentration on electrical wirings, preventing disconnection failures.

Protruding center areas increase contact area for anisotropic conductive film bonding.

A connection pad contacts side surfaces of facing substrates to establish electrical links.

Segmenting the upper common electrode and using a connection electrode directs static charges away from sensitive display areas to prevent damage.

A flexible circuit board stacks a sensor and receiver on opposite faces to compress assembly volume.

Convex pad electrodes block laser beams from damaging transistors, eliminating extra protective layers.

A display device shares pads across multiple flexible printed circuit films to reduce film width and increase pad pitch.

Elastic buffer structure absorbs contact pressure to prevent peel-off issues caused by tensile stress on flexible circuit boards in narrow full-screen displays.

Patterned carbon nanotube signal paths resist cracking on flexible substrates, eliminating bulkiness from bending restrictions.

A segmented circuit board substrate uses material webs to hold segments during embedding, reducing insulating material volume.

Dummy pads enable precise alignment of the flexible film on the display panel side surface, resolving bonding reliability issues while minimizing bezel area.

A heat transfer sheet absorbs thermal energy from a mobile display drive IC and conducts it laterally to a metallic frame.

Raised cut segmentation on flexible substrates enables sequential conductive layer printing for reliable electrical through connections.

An anisotropic conductive film bridges lead wirings and signal pads while forming a waterproof barrier against external moisture.

A flexible printed circuit board uses a protrusion with exposed metal layers to route static electricity away from internal traces.

A flexible printed circuit board with a recess embeds an image sensor to minimize device thickness while maintaining optical functionality.

Segmented boards connected by conductive fillers increase the bendable area of flexible displays while maintaining electrical connection reliability.

A printed circuit board hosts the driver chip to enable flexible signal routing within a display panel.

A flexible copper clad laminate uses a composite polyimide structure to achieve dimensional stability and high adherence.

Extending the flexible printed circuit board in a planar configuration eliminates bending-induced bulges that damage display modules during operation.

A flexible circuit board uses air as a dielectric between wiring and shielding layers to reduce signal attenuation.

Flexible lighting panel uses a bendable extension tab on the circuit board to enable versatile electrical connection orientations.

A polyimide release layer with differential adhesion enables mechanical peeling of flexible substrates from rigid support bases.

A conductive trace interconnect tape provides electrical isolation and reliable surface connections.

Spaced rigidifying features interlock under stress to arrest curvature, preventing debonding and creasing in flexible displays.

Replacing metal housings with multi-layer composites reduces device thickness while maintaining structural strength through integrated thermal pathways.

Varying side wire thickness creates a curved bonding surface that generates restoring force, preventing flexible circuit film detachment over time.

Heated anisotropic conductive particles aggregate to connect specific conductor ends while maintaining insulation between adjacent traces.

A metal tape on a flexible printed circuit board forms parasitic capacitance to match impedance with the data driver.

A substrate with three signal lines arranged in a triangular configuration to minimize electromagnetic interference between conductors.

Routing signal lines through the display panel thickness reduces bezel width while a signal controller compensates brightness uniformity.

A flexible circuit board sits between the substrate body and bent part of an array substrate to optimize space usage.

Segmented connection pads with a low-melting third layer ensure reliable ultrasonic bonding, reducing non-display areas and improving image quality.

Wider end portions on the flexible printed circuit board reduce bending tension, preventing damage to the driving chip and maintaining structural integrity.

A flexible circuit board integrates parallel side grounds and through holes to support multiple signal transmission lines.

Differentiated driving pad spacing prevents galvanic corrosion while enabling side-mounted flexible films that increase the active display area.

A display device signal wiring configuration featuring a segmented second wiring part with an open part to maintain electrical connections during rework.

Varying substrate pad widths compensates for thermal compression misalignment, ensuring optimal overlap area and bonding strength.