Display Panel Pad Openings for Gap-Fill Curing
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Solution Overview
Problem
Existing display apparatuses face bonding reliability issues between display panels and electronic components due to unreliable bonding methods, which affect conduction properties and the overall performance of the devices.
Innovation Solution
A display apparatus design that includes a display panel with lines and pads in the peripheral region, where the pads have openings for a gap-fill layer to be applied between the display panel and electronic components, enhancing bonding reliability through the use of a non-conductive gap-fill layer with a photo-initiator, and strategically arranged connection pads to facilitate curing of the gap-fill layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding methods are used to connect display panel and electronic components, then conduction property is improved, but bonding reliability deteriorates
Solution Approach 1:
A gap-fill layer is introduced as an intermediary substance between the display panel and electronic components. This gap-fill layer fills the gaps and voids in the bonding interface, providing a mediating role that enhances both mechanical bonding reliability and electrical conduction while preventing direct contact between potentially harmful surfaces
Solution Approach 2:
The bonding structure uses composite materials combining the gap-fill layer with conductive elements. The gap-fill layer itself may be a composite material designed to provide both mechanical support and electrical conduction pathways, resolving the contradiction between reliability and conduction property
2Reliability
If gap-fill layer is applied between display panel and electronic component, then bonding reliability is improved, but conduction property may deteriorate
Solution Approach 1:
The gap-fill layer incorporates a porous structure that allows for controlled electrical conduction through the material. The porosity enables ion or electron transport pathways while maintaining the mechanical bonding function, thus improving reliability without significant conduction loss
Solution Approach 2:
The electrical and mechanical parameters of the gap-fill layer are optimized to balance bonding reliability and conduction property. By adjusting composition, density, and structural parameters, the material achieves both strong bonding and adequate electrical conduction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves bonding reliability between the display panel and electronic components, preventing bonding degradation and enhancing conduction properties, thus ensuring stable and reliable performance of the display apparatus.
Implementation Method 1
a gap-fill layer disposed between the display panel and the electronic component, between the connection pads, between the pads, and in the openings, wherein each of the pads overlaps at least two pads of the connection pads, and each of the openings overlaps a region between the connection pads in a plan view
Data Source
AI summary
The present disclosure relates to a display apparatus. The display apparatus may include a display panel, a peripheral region, an electronic component, and a gap-fill layer. The display panel defines a display region. The peripheral region is adjacent to the display region. The peripheral region includes lines and pads. The lines are disposed in the peripheral region, and the pads are connected to the lines. The electronic component includes connecting pads in contact with the pads. The gap-fill layer is between the display panel and the electronic component, between the connection pads, between the pads, and in the openings. Each of the pads may overlap at least two pads of the connection pads, and the openings may overlap between the connection pads, when viewed in a plan view.