Comfort Layer for Body-Worn Leadware Using Puff Ink
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Solution Overview
Problem
Traditional comfort layers for flexible electronics used in body-worn leadware are inefficiently manufactured, lead to material waste, and cause memory folds that complicate packaging and usage, making them uncomfortable and prone to interference with the skin.
Innovation Solution
A comfort layer made of expanding plastisol puff ink is deposited directly on flexible substrates, eliminating the need for adhesives and intricate cuts, allowing for precise application and reducing material waste, while providing a soft and waterproof interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional comfort layers are laminated onto flexible electronics, then protection and comfort are provided, but manufacturing complexity and material waste increase
Solution Approach 1:
The comfort layer is integrated directly into the flexible substrate structure during the printing process, eliminating the need for separate lamination of pre-cut comfort layer materials. This merging of the comfort layer with the substrate manufacturing process reduces manufacturing steps and complexity while maintaining protective and comfortable functions.
Solution Approach 2:
The comfort layer is printed directly onto the flexible substrate without requiring pre-cut comfort layer materials or adhesive lamination steps. This extraction of the comfort layer from the traditional lamination process eliminates the need for separate manufacturing and alignment operations.
2Manufacturing precision
If traditional comfort layers are pre-cut and laminated, then precise application is achieved, but material waste increases
Solution Approach 1:
The comfort layer is printed directly in its final position on the flexible substrate, eliminating the need for pre-cutting and lamination. This self-service approach where the manufacturing process directly produces the final configuration eliminates material waste from cutting and alignment operations.
Solution Approach 2:
The comfort layer deposition is merged with the substrate printing process, allowing precise application directly where needed without separate cutting and lamination steps that generate material waste.
3Strength
If traditional comfort layers are used with adhesives, then bonding is achieved, but manufacturing time and costs increase
Solution Approach 1:
The adhesive layer and separate lamination step are removed from the manufacturing process. The comfort layer is printed directly onto the flexible substrate, eliminating the need for adhesives and separate bonding operations, thereby reducing manufacturing time and costs.
Solution Approach 2:
The comfort layer application is merged with the substrate printing process, eliminating separate adhesive application and lamination steps that increase manufacturing time and costs.
4Ease of manufacture
If traditional comfort layers are folded for packaging, then packaging is enabled, but memory folds are created that complicate usage
Solution Approach 1:
The flexible substrate with integrated comfort layer is designed with modified physical parameters (flexibility, thickness, material composition) that allow it to be packaged without creating permanent memory folds, enabling both packaging capability and maintained usability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces manufacturing time and costs, eliminates memory folds, and offers a comfortable, waterproof barrier, enhancing the usability and packaging of flexible printed electronics.
Implementation Method 1
A comfort layer can comprise ink having a soft, open texture similar to that of woven or unwoven fabrics. The comfort layer comprises an expanding plasticised or 'puff ink' that comprises an additive to plastisol inks. The plastisol puff ink that flows as a liquid or ink for purposes of deposition, and expands upon curing or the application of heat.
Data Source
Figure 1A
Figure 1B
Figure 2
AI summary
A printed electrical circuit and methods for additively printing electrical circuits. Patterned layers of conductive, insulating, semi-conductive materials, and other materials are print deposited on a flexible or rigid substrate to form electrical circuits. A buffering layer is selectively deposited to cover or encapsulate these materials to comprise a comfort layer that provides a soft and comfortable interface to the skin of a wearer. The comfort layer can be selectively deposited on the same press that the conductive, insulating, semi-conductive materials, and other materials are deposited. Further, the comfort layer is selectively deposited only where it is desired and exactly where it is desired.