3D Connection Pad Reduces Bezel Area in Display Devices

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Solution Overview

Problem

In tile-type display devices, the bezel area where drive integrated circuits or printed circuits are installed can hinder video immersion, and there is a risk of connection lines and line layers becoming open.

Innovation Solution

A display device design that includes a first substrate with a connection line, a second substrate facing the first substrate, and a connection pad that contacts the side surfaces of both substrates and the connection line, with a recessed portion exposing the connection line end and a dummy pattern, to reduce bezel area and prevent open connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the bezel area is reduced to enhance video immersion, then the visual quality improves, but the connection line and line layer may become open causing reliability issues

Engineering Contradiction:
Improvebezel areaVSAvoidconnection line integrity
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The connection pad structure transitions from a planar two-dimensional configuration to a three-dimensional configuration by forming a protruding second portion that extends into the recessed portion. This vertical dimensionality change allows the connection pad to maintain electrical connectivity while accommodating the reduced bezel area, as the connection is established through depth rather than only horizontal extension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The second portion of the connection pad is nested within the recessed portion formed in the substrate. This nesting arrangement allows the connection structure to be embedded within the available space, enabling reliable electrical connection without occupying additional horizontal space that would increase the bezel area.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If the connection pad structure is simplified to reduce manufacturing complexity, then the manufacturing process becomes easier, but the connection reliability may deteriorate

Engineering Contradiction:
Improvemanufacturing complexityVSAvoidconnection reliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The connection pad is segmented into two distinct portions: a first portion formed on the substrate surface and a second portion that protrudes into the recessed portion. This segmentation allows each portion to be optimized for its specific function - the first portion for electrical connection and the second portion for mechanical stability and stress distribution - thereby maintaining high reliability while using standard manufacturing processes.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection pad structure exhibits local quality by having different geometries in different regions. The first portion has a standard planar configuration suitable for electrical connection, while the second portion has a protruding configuration that provides enhanced mechanical support and stress distribution within the recessed portion, optimizing both reliability and manufacturability.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS12313944B2Display device and method for manufacturing same
Publication Date: 2025.05.27 SAMSUNG DISPLAY CO LTD
  • US12313944B2 patent drawing
  • US12313944B2 patent drawing
  • US12313944B2 patent drawing

AI summary

A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.