Sliding Interconnection Structure for Flexible Semiconductor Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in achieving flexible interconnection structures that maintain electrical connectivity when semiconductor devices or substrates are bent or warped, limiting their integration density and portability in portable and wearable electronics.
Innovation Solution
A flexible device with a sliding interconnection structure comprising a first and second conductive pattern embedded in a dielectric layer, where the conductive patterns have sliding contact portions and extension portions that allow for movement and maintain electrical connection even when the device is bent, utilizing a lamination technique to reduce contact resistance and enhance flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional rigid interconnection structures are used, then manufacturing precision and structural stability are improved, but flexibility and ability to withstand bending are worsened
Solution Approach 1:
The patent applies the dynamics principle by designing an interconnection structure where conductive patterns can slide relative to each other along the bending direction. The first conductive pattern and second conductive pattern are configured to slide along the longitudinal direction when the substrate bends, allowing the structure to adapt dynamically to curvature changes while maintaining electrical connection. This sliding mechanism resolves the contradiction by enabling the rigid-looking structure to behave dynamically under bending stress.
Solution Approach 2:
The patent segments the interconnection structure into multiple conductive patterns (first conductive pattern with first sliding contact portion, second conductive pattern with second sliding contact portion) that can independently move relative to each other. Each conductive pattern is separated by dielectric layers, allowing independent sliding motion. This segmentation enables the structure to accommodate bending deformation without compromising the overall electrical connectivity, resolving the contradiction between structural precision and bending flexibility.
2Reliability
If fixed rigid connections are used, then contact reliability is improved, but contact resistance under bending increases
Solution Approach 1:
The patent eliminates fixed rigid connections in favor of dynamic sliding connections. The second sliding contact portion is configured to slide on the first sliding contact portion along the longitudinal direction when bending occurs. This dynamic adjustment maintains optimal contact pressure and electrical connection throughout the bending cycle, preventing contact resistance increase while preserving connection reliability.
Solution Approach 2:
The patent changes the contact mechanism from a fixed position to a variable position along the longitudinal direction. By allowing the sliding contact portions to move relative to each other, the contact parameters (position, pressure distribution) can adapt to bending conditions. This parameter change enables the maintenance of low contact resistance under varying mechanical states while ensuring reliable electrical connection.
3Strength
If thick rigid substrates are used, then structural strength is improved, but flexibility and warpage resistance are worsened
Solution Approach 1:
The patent introduces dynamic sliding mechanisms within the substrate that allow controlled deformation. The conductive patterns can slide along the longitudinal direction when the substrate undergoes warpage or bending, effectively decoupling the rigid substrate structure from the electrical connection constraints. This enables thicker, stronger substrates to maintain flexibility by allowing internal sliding adjustment during mechanical deformation.
Solution Approach 2:
The patent segments the conductive pathways into multiple independent patterns separated by dielectric layers. This segmentation allows each conductive pattern to respond independently to substrate deformation, reducing the overall mechanical stress on any single connection path. The segmented structure enables the substrate to be thicker and stronger while maintaining flexibility, as the distributed sliding contacts can accommodate warpage without concentrating stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables flexible semiconductor packaging that maintains electrical connectivity and reduces contact resistance, allowing for increased integration density and improved portability in portable and wearable electronics by accommodating bending and warping without damage.
Implementation Method 1
The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion
Data Source
AI summary
A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.