Flexible Substrate Electrical Through Connection via Raised Cut Segmentation
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Solution Overview
Problem
Existing methods for producing electrical through connections between flexible substrates using standard printing machines face challenges, particularly with creating small holes for ink flow, as most die-cutting machines cannot produce holes smaller than 2 mm diameter, leading to ink leakage and contamination of the printing plate.
Innovation Solution
A method involving a cut on the flexible substrate that separates it into parts, allowing one part to be raised from each surface for sequential printing of conductive layers, preventing ink leakage and enabling connections between opposite surfaces without requiring specialized die-cutting machines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a small hole is made in the flexible substrate to allow ink flow, then electrical connection between surfaces is achieved, but the hole size must be precisely controlled to prevent ink leakage and printing plate contamination
Solution Approach 1:
The continuous substrate is segmented by making a cut that separates it into at least a first part and a second part. This segmentation allows the parts to be raised up independently, creating a raised structure that prevents ink leakage while maintaining electrical connection capability through the cut region.
Solution Approach 2:
The invention transitions from a two-dimensional planar connection to a three-dimensional raised structure. By raising at least one part from the plane of the first surface, the conductive ink can flow over the raised part and around the cut to establish electrical connection without leaking through to the other side.
2Productivity
If a large hole is made in the flexible substrate, then ink can flow through easily, but the printing plate becomes dirty due to ink leakage
Solution Approach 1:
By raising at least one part from the plane surface to create a three-dimensional structure, the invention allows ink to flow over the raised part and around the cut rather than leaking through a hole. This dimensional change enables productive ink flow while preventing contamination of the printing plate.
Solution Approach 2:
The raised part acts as an intermediary structure between the first and second surfaces. It provides a pathway for conductive ink to establish electrical connection while physically blocking the ink from leaking through to the other side, thus preventing printing plate contamination.
3Device complexity
If standard printing machines are used instead of specialized die-cutting machines, then device complexity is reduced, but the ability to create precise small holes for ink flow is lost
Solution Approach 1:
The invention uses segmentation through cutting and raising parts rather than requiring precise hole punching. This approach can be implemented with standard printing and cutting equipment, reducing device complexity while maintaining the precision needed for controlled ink flow and electrical connection.
4Productivity
If conductive ink is printed on both surfaces simultaneously, then production time is reduced, but ink leakage through holes causes printing errors
Solution Approach 1:
The invention performs preliminary action by raising at least one part from the plane surface before printing the conductive ink. This preliminary structuring creates a controlled pathway for ink flow, allowing subsequent printing on both surfaces to proceed accurately without ink leakage causing printing errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively creates electrical through connections without ink leakage, allowing standard printing machines to be used and simplifying the process by enabling any shape of cut, thus overcoming the limitations of traditional hole-based methods.
Implementation Method 1
the wet layer is solidified into a first dried conductive layer
Implementation Method 2
at least one of the first part and the second part is raised up from a first plane of the first surface... the first wet conductive layer is printed on the first surface, wherein the first wet conductive layer is on and around the cut
Data Source
Figure 1A~1G
Figure 1H~1M
Figure 2A~2E
AI summary
A method of producing an electrical through connection between a first surface and a second surface of a flexible substrate is taught. In the first step a cut is provided on an area of the flexible substrate. The cut extends from the first surface to the second surface and separates the area into at least a first part and a second part. In the next step, at least one of the first part and the second part is raised up from a first plane of the first surface. Then a first wet conductive layer is printed on the first surface, such that the wet conductive layer is on and around the cut. After that the wet layer is solidified into a first dried conductive layer. In the next step, at least one of the first part and the second part is raised up from a second plane of the second surface. After that a second wet conductive layer is printed on the second surface, wherein the second wet conductive layer is on and around the cut. Finally, the second wet conductive layer is solidified into a second dried conductive layer, which creates an electrical through connection with the first dried conductive layer.