Driver Chip Placement on PCB for Narrow Frame Displays
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Solution Overview
Problem
Conventional chip on film (COF) display technologies restrict the distribution of internal wires due to the placement of driver chips, leading to increased frame width and limited flexibility in signal transmission, which is disadvantageous for narrow frame displays.
Innovation Solution
The placement of a driver chip on a printed circuit board, electrically connected to wires within the display panel, allows for flexible signal transmission by adjusting the arrangement of signal lines on the printed circuit board, thereby improving the distribution of wires and reducing frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the driver chip is disposed on the chip on film, then the signal transmission can be achieved, but the distribution of internal wires is restricted and the frame width increases
Solution Approach 1:
The patent segments the driver chip from the chip on film and places it on a separate printed circuit board. This segmentation allows the internal wires to be distributed more flexibly within the display panel main body without being constrained by the chip on film structure, thereby reducing the frame width while maintaining signal transmission capability.
Solution Approach 2:
The patent introduces a flexible wiring board as an intermediary component between the display panel main body and the printed circuit board containing the driver chip. This intermediary allows signal transmission to be achieved while enabling more flexible wire distribution in the display panel, thus reducing the frame width.
2Ease of operation
If the driver chip is disposed on the chip on film, then the signal transmission can be achieved, but the flexibility of wire distribution is limited
Solution Approach 1:
By separating the driver chip from the chip on film and placing it on an independent printed circuit board, the patent enables flexible wiring designs within the display panel main body. The internal wires can now be distributed according to optimal layout considerations rather than being constrained by the chip on film position, significantly improving wire distribution flexibility.
Solution Approach 2:
The patent moves the driver chip from a two-dimensional layout on the chip on film to a three-dimensional arrangement using a separate printed circuit board connected via flexible wiring board. This dimensional change provides additional spatial freedom for wire distribution within the display panel, enhancing design flexibility.
Data Source
AI summary
The present application discloses a display panel and a display device. The display panel includes a display panel main body, a flexible wiring board, and a printed circuit board. The display panel main body includes a plurality of wires, and the display panel main body is connected to an end of the flexible wiring board. The printed circuit board is connected to another end of the flexible wiring board. The printed circuit board includes a driver chip, and the driver chip is electrically connected to the wires.