Curved Side Wire Bonding for Flexible Circuit Durability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display devices face challenges in securely bonding flexible printed circuit films to their edges, leading to potential durability and reliability issues due to weak bonds that may degrade over time.
Innovation Solution
The display device incorporates a curved surface for bonding the flexible printed circuit film, utilizing side wires with varying thicknesses and widths along the edges of substrates to create a restoring force that reinforces the bond, ensuring a more secure and durable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible printed circuit film is bonded to the edge of the display panel, then driving signals can be transmitted to the display panel, but the bonding strength is weak and reliability deteriorates over time
Solution Approach 1:
The patent applies curvature to the bonding surface by forming side wires with varying thicknesses that create a curved profile on the substrate edge. This curved surface allows the flexible printed circuit film to be bonded in a curved state, generating a restoring force that continuously presses the film against the bonding surface, thereby maintaining strong bonding over time and improving both reliability and durability.
Solution Approach 2:
The patent changes the thickness parameter of the side wires along the bonding surface, creating a gradient structure where wire thickness varies from the center to the edges. This parameter change creates the curved surface profile that enables the flexible printed circuit film to generate restoring force, solving the bonding strength and durability issue.
2Strength
If the flexible printed circuit film is bonded flat to the substrate, then the structure is simple, but the bonding strength is insufficient and the film may detach
Solution Approach 1:
Instead of a flat bonding surface, the patent introduces a curved surface formed by side wires with varying thicknesses. This curvature allows the flexible printed circuit film to be bonded in a bent state, generating elastic restoring force that continuously presses the film against the bonding surface, significantly enhancing bonding strength while adding only moderate structural complexity.
3Stability of the object's composition
If side wires with uniform thickness are used, then manufacturing is simple, but the bonding stability is insufficient
Solution Approach 1:
The patent applies local quality by varying the thickness of side wires at different positions along the bonding surface. The center portion has different wire thickness compared to the edge portions, creating a non-uniform structure that generates optimal restoring force distribution. This localized variation improves bonding stability while maintaining reasonable manufacturing feasibility through controlled deposition processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the bonding strength and stability of the flexible printed circuit film to the display device, improving the overall durability and reliability by utilizing the restoring force of the curved surface.
Implementation Method 1
The flexible printed circuit film may be curved along a direction in which the first edge extends. The curved surface for bonding the flexible printed circuit film utilizes side wires with varying thicknesses and widths along the edges of substrates to create a restoring force that reinforces the bond
Data Source
AI summary
A display device according to an exemplary embodiment of the present invention includes: a first substrate and a second substrate; a plurality of signal lines that are formed on the first substrate or on the second substrate; and a plurality of side wires that are disposed in a side surface of a first edge of the first substrate and a side surface of a second edge of the second substrate, wherein the plurality of side wires are disposed apart from each other along a direction in which the first edge extends, and are connected with the plurality of signal lines, and a first thickness of side wires disposed at an end of the first edge and at and end of the second edge is different from a second thickness of the side wire disposed at inside of the edges of the first edge and the second edge.