Segmented Circuit Board Substrate with Material Webs
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Solution Overview
Problem
Current methods for producing circuit boards, especially for high-current applications, are inefficient in terms of material usage and heat management, as they require significant amounts of insulating material, leading to increased height and complexity in production.
Innovation Solution
A method involving an electrically conducting shaped part with segments connected by webs of material, which are embedded in insulating material, followed by the application of a conductor structure and subsequent cutting through the webs to release the segments, minimizing material usage and optimizing heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If significant amounts of insulating material are used to ensure electrical insulation and structural integrity, then reliability is improved, but the circuit board height increases and heat management efficiency deteriorates
Solution Approach 1:
The shaped part is divided into multiple segments that are electrically insulated from each other by being separated through the webs of material. This segmentation allows for high-current applications with proper electrical insulation while minimizing the overall insulating material required, thereby improving heat management efficiency.
Solution Approach 2:
The webs of material connecting the segments are cut through to release the segments from their integral connection. This extraction of the connecting material allows the segments to be electrically insulated while reducing the total amount of insulating material needed in the circuit board structure.
2Manufacturing precision
If insulating material is applied laminarly to fill joints, then manufacturing precision is improved, but material costs increase and production complexity increases
Solution Approach 1:
The shaped part with segments and webs of material is prepared in advance, with the webs positioned at specific locations. This preliminary arrangement allows for precise filling of joints with insulating material during embedding, reducing the need for complex post-processing steps and lowering production complexity.
Solution Approach 2:
The webs of material serve as intermediaries that facilitate the embedding of insulating material into the joints between segments. These webs provide a structured framework that guides the insulating material filling process, improving manufacturing precision while simplifying the overall production process.
3Ease of operation
If segments are separated early in the process, then ease of operation is improved, but manufacturing precision deteriorates due to positioning difficulties
Solution Approach 1:
The segments are kept integrally connected through the webs of material during the embedding and conductor structure attachment processes. This preliminary connection ensures precise positioning and alignment, and only after these critical steps are completed are the webs cut through to separate the segments, maintaining manufacturing precision while enabling easy operation.
Solution Approach 2:
The webs of material provide a structural cushioning that maintains the segments in their correct positions during the manufacturing process. This beforehand support ensures precise positioning of the conductor structure and proper alignment of segments, and only after these positions are secured are the segments separated by cutting the webs.
Data Source
AI summary
A method for producing a circuit board and a shaped part for use in this method are provided. To simplify the production of circuit boards, save insulating material and thereby also reduce the height of the circuit board for efficient heat management, the method according to the invention for producing circuit boards comprises the following steps: Step A: providing an electrically conducting shaped part (1) with at least two segments (2a-g), which are integrally connected just by webs of material (M); Step B: embedding the segments (2a-g) in insulating material to form at least one circuit-board substrate (LS); Step C: applying a conductor structure (4a, 4b) to the circuit-board substrate (LS) to form the circuit board (LP); and Step D: releasing the integral connection of the segments (2a-g) by breaking through the webs of material (M).