Flexible Circuit Board Sensor Receiver Stacking

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Solution Overview

Problem

The increasing complexity of electronic device design due to integrated components complicates the achievement of a thinner mobile phone form factor, as existing technologies struggle to optimize component positioning and size reduction.

Innovation Solution

An electronic assembly comprising a flexible circuit board with a sensor on one face and a receiver on the opposite face, where the receiver's sound channel is communicated to the outside either through or bypassing the circuit board, allowing for a compact design by stacking and sealing the components together.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If more components are integrated inside the electronic device to realize more functions, then the functionality is improved, but the device thickness increases and design becomes more complicated

Engineering Contradiction:
ImprovefunctionalityVSAvoiddevice thickness
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The receiver is nested within the cavity formed by the flexible circuit board, with the sound channel passing through the circuit board. This nesting arrangement allows the receiver to be housed within the existing structure without increasing overall device thickness, while still providing complete audio functionality.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The sound channel is configured to extend in the thickness direction of the flexible circuit board, utilizing the Z-axis dimension for sound transmission. This dimensional approach allows sound to pass through the circuit board itself rather than requiring additional lateral space, thereby maintaining a thin profile while achieving full audio function.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If more components are integrated inside the electronic device, then the functionality is improved, but the position relationships among components become more complicated

Engineering Contradiction:
ImprovefunctionalityVSAvoidcomponent positioning complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The flexible circuit board serves multiple functions simultaneously: it provides electrical connection between components, forms a protective cavity for the receiver, and acts as a sound transmission channel. This merging of functions reduces the number of separate components and simplifies the overall structure despite integrating multiple functionalities.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The flexible circuit board is designed as a multi-functional component that performs electrical connection, structural support, cavity formation, and acoustic transmission. This universal design approach allows a single component to fulfill multiple roles, thereby reducing component positioning complexity while maintaining enhanced functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Volume of moving object

If the receiver is disposed on the second face of the flexible circuit board with sound channel through the board, then the size is reduced, but the sound transmission path must pass through the circuit board material

Engineering Contradiction:
Improveassembly sizeVSAvoidsound transmission quality
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The flexible circuit board is designed with different properties in different regions: the main body provides structural support and electrical connection, while the sound channel region is configured to allow acoustic transmission. This local differentiation ensures that the circuit board material in the sound channel path does not degrade audio quality, while maintaining overall size reduction.

Inventive Principle:
Principle #3Local quality

Data Source

PatentEP3506608B1Electronic assembly and electronic device
Publication Date: 2020.06.03 GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
  • EP3506608B1 patent drawingFigure 1
  • EP3506608B1 patent drawingFigure 2
  • EP3506608B1 patent drawingFigure 3

AI summary

The electronic assembly (1) includes a flexible circuit board (12, 12', 12", 12"'), a sensor (11, 11', 11", 11'"), and a receiver (13, 13', 13", 13'"). The flexible circuit board (12, 12', 12", 12'") includes a first face (121, 121", 121'") and a second face (122, 122", 122'") opposite to the first face (121, 121", 121'"). The sensor (11, 11', 11", 11'") is disposed on the first face (121, 121", 121'") of the flexible circuit board (12, 12', 12", 12'"). The receiver (13, 13', 13", 13'") is disposed on the second face (122, 122", 122'") of the flexible circuit board (12, 12', 12", 12'"). A sound channel (131, 131", 131'") for the receiver (13, 13', 13", 13'") is communicated to outside bypassing the flexible circuit board (12, 12', 12", 12'") or through the flexible circuit board (12, 12', 12", 12'").