Conductive Trace Interconnect Tape for PCB Repair
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Solution Overview
Problem
Printed circuit boards and flexible circuit substrates often require costly and time-consuming re-manufacturing due to missing traces, with existing repair methods like soldering wires being unreliable due to protrusions that can catch on objects.
Innovation Solution
A conductive trace interconnect tape with a top insulating layer, electrically conductive layer, and bottom insulating layer, which can be cut and soldered to create new traces on a printed circuit board or flexible circuit substrate, providing low-cost and quick turnaround solutions while lying nearly flush on the surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wires are soldered to correct missing traces, then the traces can be added to the circuit board, but the wires stick up from the surface and can get caught on objects reducing reliability
Solution Approach 1:
The patent uses a flexible circuit substrate with a thin profile that can be conformally attached to the circuit board surface. This flexible film approach eliminates protruding wires while maintaining electrical connectivity, directly resolving the reliability issue caused by sticking-up wires.
Solution Approach 2:
The invention transitions from three-dimensional wire connections to a two-dimensional planar trace structure on the flexible substrate. This dimensional change allows the traces to lie flush with the board surface, eliminating the protrusion problem while maintaining circuit functionality.
2Reliability
If a new printed circuit board is fabricated with corrections, then the missing traces are corrected, but the costs increase and additional fabrication time is required
Solution Approach 1:
The flexible circuit substrate with conductive traces is pre-fabricated separately and then attached to the existing circuit board. This preliminary preparation allows for quick installation without requiring time-consuming re-fabrication of the entire board, significantly reducing turnaround time.
Solution Approach 2:
The solution separates the trace correction function from the main circuit board by using a distinct flexible substrate. This segmentation allows the correction layer to be independently fabricated and then applied to the board, avoiding the need to re-fabricate the entire assembly.
3Reliability
If a new printed circuit board is fabricated with corrections, then the missing traces are corrected, but the costs increase
Solution Approach 1:
The patent combines the circuit board with a flexible circuit substrate that contains the corrective traces. This merging creates a hybrid structure that leverages the strengths of both technologies, providing trace corrections at lower cost than complete board re-fabrication while maintaining reliability.
Solution Approach 2:
The flexible circuit substrate serves as a cost-effective, replaceable layer for trace corrections. Rather than investing in expensive re-fabrication of the entire circuit board, this approach uses a simpler, cheaper substrate that can be attached and soldered to provide the necessary electrical connections.
Data Source
AI summary
A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.