Buffered Solder Jetting Head for Impact-Resistant Paste Deposition
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Solution Overview
Problem
Conventional solder jetting heads experience damage and efficiency loss due to impact energy between the tappet and nozzle portions, leading to frequent replacements and increased production costs.
Innovation Solution
Incorporation of a buffering portion between the support and nozzle portions to absorb impact energy generated during the enclosing contact, using elastic structures, springs, magnetic assemblies, air cushions, or dampers to mitigate the effects of instantaneous momentum and shock waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the tappet portion strikes the nozzle portion with sufficient force to jet solder paste, then the solder paste deposits exit through the nozzle opening at high speed, but impact energy damages the tappet portion and nozzle portion over time
Solution Approach 1:
A buffering portion is introduced between the support portion and the nozzle portion to absorb impact energy generated when the tappet portion strikes the nozzle portion. This cushioning structure prevents damage accumulation from repeated striking, thereby extending the service life of the tappet portion and nozzle portion while maintaining high-speed solder paste deposition capability.
2Manufacturing precision
If the tappet portion contacts the nozzle portion to form enclosing contact, then solder paste is forced to exit in controlled amounts, but solder particles deform into sheets and accumulate on contact surfaces
Solution Approach 1:
The buffering portion acts as an intermediary element between the support portion and the nozzle portion. It absorbs the impact energy that would otherwise be transmitted to the solder particles during the enclosing contact process, preventing the deformation of spherical solder particles into flat sheets that accumulate and cause blockages.
3Reliability
If frequent replacement of tappet portion and nozzle portion is performed to maintain jetting quality, then component reliability is maintained, but production efficiency decreases and costs increase
Solution Approach 1:
By incorporating the buffering portion to absorb impact energy beforehand, the deterioration of the tappet portion and nozzle portion is significantly reduced. This allows these components to maintain their functional quality for extended periods without requiring frequent replacement, thereby improving production efficiency and reducing costs while maintaining jetting process reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deterioration of the tappet and nozzle portions, reduces solder particle deformation, and eliminates the need for replacements, thereby enhancing production efficiency and reducing costs.
Implementation Method 1
a buffering portion positioned between the support portion and the nozzle portion, the buffering portion being configured to absorb impact energy generated when the enclosing contact is formed
Implementation Method 2
using elastic structures, springs, magnetic assemblies, air cushions, or dampers to mitigate the effects of instantaneous momentum and shock waves
Implementation Method 3
mitigate the effects of instantaneous momentum and shock waves
Data Source
AI summary
A solder jetting head for depositing a solder paste onto a target surface is provided. The solder jetting head comprises: a tappet portion driven to provide a striking force; a nozzle portion for forming an enclosing contact with the tappet portion, the nozzle portion being configured to force the solder paste to exit from the nozzle portion; a support portion for supporting the nozzle portion; and a buffering portion positioned between the support portion and the nozzle portion, the buffering portion being configured to absorb impact energy generated when the enclosing contact is formed.