Solder Feeding Devices TRIZ Cases
- Buffered Solder Jetting Head for Impact-Resistant Paste Deposition
A buffering layer between the nozzle and support absorbs tappet impact, reducing wear, solder deformation, and jetting downtime.
- Selective Solder Nozzle Camera Feedback for Stable Solder Waves
Real-time camera feedback detects solder wave shape and height, enabling automatic nozzle adjustment for more consistent PCB soldering.
- Conductive Ball Mounting Head With Downward Gas-Flow Nozzles
Downward compressed-gas nozzles in a flat head assembly guide tiny conductive balls into mask recesses for faster, more even mounting.
- Reciprocating Solder Tank Extension for Dross Decomposition
Horizontal reciprocation in molten solder cuts and separates dross, limiting lump formation and supporting continuous solder processing.
- Tape Solder Reel Holder Layout for Easy Unit Replacement
A modular reel holder and guide layout lets tape-like solder units be replaced laterally, reducing spacing and maintenance burden in multi-unit lines.
- Solder Paste Cartridge Geometry for Low-Waste Bubble-Free Dispensing
Angled chamber panels and a moving push member improve solder paste transfer, cut waste, and reduce bubble-related SMT defects.
- Solder Machine Alignment Tool for Laser and Wire Feeder Setup
A three-part alignment tool mirrors laser and solder wire feeder positioning to replace trial-and-error setup and cut solder machine alignment time.
- Sharp-Edge Solder Jetting Head to Prevent Paste Accumulation
A sharp-edge tappet-nozzle contact reduces solder particle deformation and paste buildup, improving jetting stability and cutting cleaning time.
- Magnetic Frameless Separating Strip for Selective Wave Soldering
Magnetic frameless strips guide solder flow in selective wave soldering, reducing solder bridges while simplifying nozzle changes and maintenance.
- Multi-Nozzle Laser Soldering With Real-Time Beam Position Correction
Sensor feedback and dynamic focusing correct laser beam offset in real time, improving solder ball alignment and soldering consistency.
- Laser Solder Sphere Reflow for Accurate Head-Gimbal Connections
Two timed laser pulses melt and reflow a solder sphere for head-gimbal assembly joints with less heat transfer and better connection accuracy.
- Laser Brazing Wire Feed Line with Integrated Gas Shielding
Transfer openings on the wire feed line distribute process gas around the soldering material, preventing pore formation and smoke traces at the joint.
- Wire Feeding Apparatus with Electromechanical Sensor
Electromechanical sensor replaces mechanical carriage guide to eliminate friction and dirt susceptibility, ensuring consistent feed control.
- Liquid Dosing Nozzle With Hollow Plunger for Residue-Free Application
A hollow plunger extends through liquid into a tapering nozzle to eject portions outward during movement.
- Solder Ball Supply via Vibration for Fine-Pitch Electrodes
Vibration fills narrow openings with solder balls, eliminating flux residue and washing steps.
- Solder Bath Thermal Diffusion Member for Uniform Heating
A stainless steel thermal diffusion member mounted on the solder bath outer surfaces ensures uniform temperature distribution and prevents heat loss to air.