Solder Feeding Devices TRIZ Cases
- Buffered Solder Jetting Head for Impact-Resistant Paste Deposition
A buffering layer between the nozzle and support absorbs tappet impact, reducing wear, solder deformation, and jetting downtime.
- Selective Solder Nozzle Camera Feedback for Stable Solder Waves
Real-time camera feedback detects solder wave shape and height, enabling automatic nozzle adjustment for more consistent PCB soldering.
- Conductive Ball Mounting Head With Downward Gas-Flow Nozzles
Downward compressed-gas nozzles in a flat head assembly guide tiny conductive balls into mask recesses for faster, more even mounting.
- Reciprocating Solder Tank Extension for Dross Decomposition
Horizontal reciprocation in molten solder cuts and separates dross, limiting lump formation and supporting continuous solder processing.
- Tape Solder Reel Holder Layout for Easy Unit Replacement
A modular reel holder and guide layout lets tape-like solder units be replaced laterally, reducing spacing and maintenance burden in multi-unit lines.
- Solder Paste Cartridge Geometry for Low-Waste Bubble-Free Dispensing
Angled chamber panels and a moving push member improve solder paste transfer, cut waste, and reduce bubble-related SMT defects.
- Solder Machine Alignment Tool for Laser and Wire Feeder Setup
A three-part alignment tool mirrors laser and solder wire feeder positioning to replace trial-and-error setup and cut solder machine alignment time.
- Sharp-Edge Solder Jetting Head to Prevent Paste Accumulation
A sharp-edge tappet-nozzle contact reduces solder particle deformation and paste buildup, improving jetting stability and cutting cleaning time.
- Magnetic Frameless Separating Strip for Selective Wave Soldering
Magnetic frameless strips guide solder flow in selective wave soldering, reducing solder bridges while simplifying nozzle changes and maintenance.