Multi-Nozzle Laser Soldering With Real-Time Beam Position Correction
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Solution Overview
Problem
The accuracy of laser irradiation in soldering processes is compromised by external shocks, vibrations, and operator errors, leading to inconsistent soldering positions and quality in surface-mounting methods for electronic components.
Innovation Solution
A multi-nozzle laser soldering device with a controller, transfer unit, and sensor units that adjust the laser beam's irradiation position in X, Y, and Z directions to compensate for displacements, ensuring precise alignment and melting of solder balls, using a dynamic focusing module and camera module for real-time monitoring and correction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser irradiation is applied to solder ball surface for high-accuracy and high-quality soldering, then soldering quality is improved, but soldering position accuracy deteriorates due to external shock, vibration, or operator error in laser irradiation position setting
Solution Approach 1:
The patent employs sensor units that detect the actual position of the solder ball and provide feedback to the controller. The controller then adjusts the laser irradiation position based on this feedback, compensating for deviations caused by external shocks, vibrations, or initial positioning errors. This closed-loop feedback mechanism ensures both high soldering quality and accurate laser irradiation positioning.
Solution Approach 2:
The system dynamically changes the laser irradiation position parameters based on real-time solder ball position detection. By adjusting the irradiation coordinates according to detected position variations, the system maintains accurate soldering despite external disturbances or initial positioning errors.
2Ease of manufacture
If preset laser irradiation position is used, then soldering process is simple, but soldering position deteriorates due to external shock or vibration
Solution Approach 1:
The sensor units continuously monitor solder ball position and provide feedback to the controller, which automatically adjusts laser irradiation positioning. This maintains soldering position consistency and reliability without complicating the overall soldering process, as the adjustment occurs automatically based on detected position variations.
Solution Approach 2:
The system performs self-adjustment by detecting position deviations and automatically correcting laser irradiation positioning without requiring manual intervention. This maintains process simplicity while improving reliability through automatic compensation for external shocks and vibrations.
3Device complexity
If laser irradiation position is manually set by operator, then device complexity is low, but manufacturing precision deteriorates due to operator error
Solution Approach 1:
The sensor units detect actual solder ball positions and provide feedback to the controller, which automatically calculates and adjusts the optimal laser irradiation position. This eliminates operator error while keeping the device complexity manageable through automated position-based control.
Solution Approach 2:
The patent replaces manual operator positioning with an automated optical sensing and control system. The sensor units and controller work together to determine and adjust laser irradiation position automatically, substituting human judgment with precise optical measurement and computational control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the accuracy of laser irradiation, enhancing the quality and consistency of soldering by correcting errors in real-time, thereby improving the reliability of electronic component mounting processes.
Implementation Method 1
a laser generator configured to generate the laser beam for applying heat to the solder ball
Implementation Method 2
laser beam for applying heat to the solder ball
Implementation Method 3
at least one beam converter configured to adjust an output area or a shape of the laser beam
Implementation Method 4
a sensor unit measuring a position of the laser beam irradiated into a surface of the solder ball or the nozzle
Implementation Method 5
a sensor unit measuring a profile of the laser beam; a sensor unit measuring a size of the laser beam
Implementation Method 6
a transfer unit configured to transfer a plurality of objects
Data Source
AI summary
The present invention provides a laser soldering device including a transfer unit configured to transfer a plurality of objects, a solder unit configured to operate under control of the controller to solder the object positioned on the transfer unit, and form a bonding surface by performing the soldering by a laser beam, and at least one nozzle unit in which a solder ball to which the laser beam is irradiated is accommodated, in which the laser beam irradiated from the solder unit is eccentric with respect to a center line of the solder ball and adjusted to be irradiated.